this section of the ceramic substrate design concept is to allow high power, small size, high brightness LED use
development designed to replace a section merit system board, directly to multiple LED chip package on top,
and then by the second optical lens more compact size makes the product volume and let your light LED
products reduce the area, reducing materials, system cost, the human cost of replacing the assembly, so
that you package more quickly, Wire bonding the chip directly on the substrate, with the use of ceramic
heat with excellent results, but also allow your LED brighter and longer life.
This product suitable for high power LED's package, such as: LED lights
Compared to the common PCB, Sliton ceramic substrate is more thermal & voltage resistant, which can be applied in the field of smart lighting, smart chips, electronic materials, aerospace, LED, sensors, etc. This new material, using laser speedy activation and metallization technology, has the advantages of printing speediness, delivery speediness, size selection, specification and customization over the others.
Substrate name Ceramic Substrate for High Brightness LED Applications Substrate material thickness 0.635mm
Conducting layer Cu
Solder maskï¼?no
The photosensitive sensor is currently the highest yield, the most widely used sensor, exist in the form of photosensitive resistance, along with the change of light intensity, the resistance value is also relatively change, resulting with the light intensity of the pulse signal.
The structural elements of common cadmium sulphide photosensitive electrode are: electrode / cadmium sulfide / ceramic substrate / wire / resin moisture-proof film, etc.. Ceramic substrates have been widely used in photosensitive resistors.
Product features:
The ceramic circuit board has high accuracy and good electrical and thermal properties
2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole
3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology
4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced
5. Customized production, without mold opening, short production cycle
6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life.
7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment.
8. High frequency loss, it can be used in high frequency circuit.
9. Copper sealing, high reliability.
10. 3d substrate and 3d routing.
1. Ceramic circuit board appearance size is not limited
2., ceramic laser printing, three-dimensional routing
3. Ceramic circuit board without mask, fast response
4. Ceramic circuit board technology is mature, environmental protection, pollution-free
ceramic circuit board with Led heat dissipation and long service life
Folysky Technology (Wuhan) Co.,Ltd.is a professional high-tech enterprise engaging in planar and curved non-metallic base planel, electronic circuit board and electronic components which integrates research and development, production and sales. It has a unique technical advantage in the direct graphics of PCB by developing the powerful wuhan photoelectric national laboratory.
The company's main product is ceramiccircuit board, such as alumina ceramic circuit board,aluminum nitride ceramiccircuit board, zirconia ceramic circuit board, glass circuit board,LEDceramic circuit board (including 2D and 3D circuit board), Â with self-developed technology of Laser rapid Activation Metallization (Laser Activation Metallization, LAM technology for short).
High bonding strength and good electrical performance between metal and ceramic can be repeated welding. Metal layer thickness is adjustable in 1 mu m - 1 mm. L/S resolution can reach 10m, which can realize sealing plating directly, form double-sided substrate, and
provide customized, high density PCB solutions for customers.
At present, the conventional LED lighting system on the market has the quality problems caused by poor heat dissipation and short life of the driving power. The inconvenience of maintenance and repair also limits the LED lamp's comprehensive replacement of traditional lamps to a certain extent. The ceramic circuit board produced by our company has a strong heat dissipation capacity, and the installation of ceramic circuit board on the LED lamp is long life! You are totally worth it..
3535 technical parameters of ceramic circuit board:
Base material type: alumina ceramics
Substrate material thickness: 0.5mm
Conductive layer: Copper
Thickness of metal layer: 35 mu m/35 mu m
Surface treatment: heavy silver
One side / double side of metal: double side
Copper plated through holes: Yes
Resistance welding: Yes
strate name:custom design service for ceramic metallized substrates
Substrate material thickness:0.635mm
Conducting layer:Cu, Ni, Au
Thickness of metal layer:300�¼m
Surface preparation:immersion gold
Metal single-sided / double sided:single sided
Copper plated through hole:no
Solder mask:no
There are three kinds of forming methods of ceramic substrate: pressing film, dry pressing and casting forming. The casting process has the highest forming production efficiency, and it is easy to realize continuous production and automation. It can improve product quality, reduce costs and realize mass production. The thickness of the production substrate can be as thin as 10m or less than 1mm. Casting forming is an important step in the practical transformation of aluminum nitride ceramic circuit board, and has an important application prospect.
We are a unique name in the industry as a leading Supplier of Nitride Ceramic PCB in Wuhan, Hubei, China.
Substrate type:aluminium nitride ceramics
Conducting layer:Cu
Surface preparation:immersion gold
Metal single-sided / double sided:double sided
Copper plated through hole:yes
Solder mask:no
Backed by rich industry experiences, we are leading Manufacturer and Supplier of Customized Integrated Circuit Board in Wuhan, Hubei, China.
Folysky Technology is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer�¢�?�?s expectations.
Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications.
Industry standard materials polished are 99.6% Alumina, 96% Alumina, AlN, BeO, Sapphire, Fused Silica. Centerline polishes virtually any ferrous or non ferrous material.
Centerline Technologies�¢�?�? polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required
The photosensitive sensor is currently the highest yield, the most widely used sensor, exist in the form of photosensitive resistance, along with the change of light intensity, the resistance value is also relatively change, resulting with the light intensity of the pulse signal.
The structural elements of common cadmium sulphide photosensitive electrode are: electrode / cadmium sulfide / ceramic substrate / wire / resin moisture-proof film, etc.. Ceramic substrates have been widely used in photosensitive resistors.
Product features:
The ceramic circuit board has high accuracy and good electrical and thermal properties
2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole
3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology
4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced
5. Customized production, without mold opening, short production cycle
6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life.
7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment.
8. High frequency loss, it can be used in high frequency circuit.
9. Copper sealing, high reliability.
10. 3d substrate and 3d routing.
1. Ceramic circuit board appearance size is not limited
2., ceramic laser printing, three-dimensional routing
3. Ceramic circuit board without mask, fast response
4. Ceramic circuit board technology is mature, environmental protection, pollution-free
Product parameters
Substrate typealumina ceramics
Substrate material thickness0.5mm
Conducting layercu
Thickness of metal layer35m/35m
Surface preparationheavy silver
Metal single-sided /double sideddouble sided
Copper plated through holeyes
Solder maskyes
Product features
1.High precision, good electrical and thermal properties, high bonding strength of.
2.Good weldability, blind hole through hole can be realized
3.Mature technology, environmental protection, pollution-free, cost is lower than traditional technology.
4. A wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced.
5. Customized production, without mold opening, short production cycle.
Company profile
Folysky technology (wuhan) co., ltd., is a professional engaged in the plane, three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production, sales as one of the high-tech enterprises, which owns the well-known brand of ceramic circuit substrate -- slitong.
Product features:
The ceramic circuit board has high accuracy and good electrical and thermal properties
2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole
3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology
4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced
5. Customized production, without mold opening, short production cycle
6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life.
7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment.
8. High frequency loss, it can be used in high frequency circuit.
9. Copper sealing, high reliability.
10. 3d substrate and 3d routing.
1. Ceramic circuit board appearance size is not limited
2., ceramic laser printing, three-dimensional routing
3. Ceramic circuit board without mask, fast response
4. Ceramic circuit board technology is mature, environmental protection, pollution-free
High ceramic PCB thermal conductivity is probably the leading reason more industries are turning to ceramics in their printed circuit boards and packages, as this material has a clear edge over plastics in this regard. Better CTE matching and hermetic sealing only add to the appeal of these materials. The challenge is that these materials, and the boards your ceramic PCB manufacturer makes from them, are considerably more expensive than materials for traditional printed circuit boards, which can add up significantly over the length of a high-volume job. However, the benefits of ceramic boards and the need for heightened thermal conductivity is so great, any company in a relevant industry that can afford to use ceramic boards will probably do so out of necessity.
While we can have an estimate of the level of thermal conductivity each ceramic board can provide, the final values will vary depending upon the manufacturing process, in addition to grain size and composition. We can offer a range of values that experts seem to agree upon.
Thermal conductivity for one of the most popular, although expensive ceramics â?? aluminum nitride â?? is one that many identify as over 150 W/mK, usually around 180 W/mK. However, studies find values ranging all the way from 80 W/mK to 200 W/mK at room temperature, with values dropping by more than one-third as you approach 100 degrees Celsius. Other thermal ranges we can identify at room temperature include 18-36 W/mK for aluminum oxide, 184 to 300 for beryllium oxide, 15 to 600 for boron nitride and 70-210 for silicon carbide.
Because the variations are so wide, it is difficult to pin down actual thermal conductivity numbers. Your best approach will be to do your own testing, record the values you obtain and use those in your future calculations.
Today ceramics are already widely used as substrates in many microelectronic components and power led packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are chip-on-board (cob) modules, high power circuits, proximity sensors, battery drivers for evs, - .
Ceramics advantages over other printed circuit boards:
Lower expansion coefficient
Good thermal properties
Superior high frequency performance
Lower system cost: reduces test, insertion, assembly
Smaller package size due to integration
Cost effective for dense package due to parallel processing of layers
Hermetic packages possible, 0% water absorption
For a long time, AL2O3 and Beo ceramics have been used in most high power hybrid of IC circuit board materials, but the thermal conductivity and thermal expansion coefficient of AL2O3 substrates do not match with Si. Although Beo has excellent comprehensive performance, its high production cost and high toxicity limit its application and popularization. Therefore, considering the performance, cost and environmental protection, the two can not meet the development and demand of modern electronic power devices.
Aluminum nitride ceramic with excellent comprehensive properties is a new generation of advanced ceramics which has received extensive attention in recent years. It has a wide application prospect in many aspects. Especially, it has the advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching with silicon and non-toxicity, making it an ideal material for high density, high power and high speed integrated circuit boards and packaging substrates.
If you want to sample thin film ceramic substrates, you can consider choosing manufacturers based on the following factors:
1. Product quality: Choose manufacturers with good product quality to avoid unnecessary troubles caused by quality problems later on. You can refer to customer reviews, product certifications, industry reputation, etc. to evaluate the manufacturer.
2. Technology level: The manufacturer's technology level and technical strength are directly related to product quality. You can check the relevant qualifications of the manufacturer's production equipment, production processes, and technology, and visit their production line to understand their manufacturing processes.
3. Service experience: Excellent service can help customers solve problems, provide support, especially in communication, exchange, after-sales service, etc. You can learn about the manufacturer's service level through online customer service, phone service, email replies, etc.
4. Cost control: Cost is also a key factor to consider when choosing a manufacturer. You can compare quotes from multiple manufacturers, but also be careful not to sacrifice product quality and service by choosing a low-cost manufacturer.
