Today ceramics are already widely used as substrates in many microelectronic components and power led packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are chip-on-board (cob) modules, high power circuits, proximity sensors, battery drivers for evs, - .
Ceramics advantages over other printed circuit boards:
Lower expansion coefficient
Good thermal properties
Superior high frequency performance
Lower system cost: reduces test, insertion, assembly
Smaller package size due to integration
Cost effective for dense package due to parallel processing of layers
Hermetic packages possible, 0% water absorption