For a long time, AL2O3 and Beo ceramics have been used in most high power hybrid of IC circuit board materials, but the thermal conductivity and thermal expansion coefficient of AL2O3 substrates do not match with Si. Although Beo has excellent comprehensive performance, its high production cost and high toxicity limit its application and popularization. Therefore, considering the performance, cost and environmental protection, the two can not meet the development and demand of modern electronic power devices.

Aluminum nitride ceramic with excellent comprehensive properties is a new generation of advanced ceramics which has received extensive attention in recent years. It has a wide application prospect in many aspects. Especially, it has the advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching with silicon and non-toxicity, making it an ideal material for high density, high power and high speed integrated circuit boards and packaging substrates.