Layers Count:1L
Base Mateial:Alu
Board Thickness: 1.0±0.15mm
Copper Thickness: 1/0 oz
Min Hole: 0.20mm(8mil)
Min Trace Width: 0.5mm(19mil)
Min Trace Spacing: 0.5mm(19mil)
Surface Finishing: ENIG
Test: Flying probe
Panel Dimension:98mX98mm/pcs
Panel Method: 1up, 1*1
Lead Time:fastest 1wds,normal 5-6wds
Base Material: FR-4+FPC, coverlay, standing PP
Board Layers:2L
Copper Thickness: 4/4 OZ(1OZ=35um)
Board Thickness: 1.60±0.15mm
Min Hole: 0.30mm(12mil)
Min Trace Width: 13 mil
Min Trace Spacing: 14 mil
Surface Finishing: HASL
Test Way: Flying Probe
Min Hole: 0.30mm(12mil)
Lead Time: Fastest 2wds,Normal 5-10wds
Base Material: FR-4+FPC,coverlay, standing PP(tg170)
Copper Thickness: 1/0.5/0.5/1 OZ(1OZ=35um)
Boar Thickness: 1.00±0.10mm
Min Hole: 0.30mm(12mil)
Min Trace Width: 0.15mm(6mil)
Min Trace Spacing: 0.12mm(5mil)
Surface Finishing: ENIG
Test Way: Flying Probe
Dimention: 110.74mmX88.27mm/PCS
Min Hole: 0.30mm(12mil)
Lead Time:Fastest 3wds,Normal 5-10wds
Layers: 2L
Material: FR-4
Thickness:4.8mm
Copper Thickness: 3/3 OZ
Board Size:38.1mm*35.6mm
Min line width/spacing:8mil/8mil
Surface Finishing: HAL
File format: Gerber file ( RS274-X )
Min hole: 43mil (1.075mm )
Layer count:2l
Base material: fr-4
Copper thickness: 1/1 oz(35/35 um)
Board thickness: 1.60±0.15mm
Dimension: 155.52mmx74.46mm/1up
Min hole diameter: 0.40mm(16mil)
Min trace width: 0.20mm(8mil)
Min trace spacing: 0.15mm(6mil)
Surface finishing: osp
Test: fixture/flying probe
Via diameter: 0.40mm(16mil)
Lead time:fastest 24h, nomal 3-5wds
Layers Count:2L
Base Mateial:Alu
Board Thickness: 1.60±0.15mm
Copper Thickness: 2/2 oz
Min Hole:0.20mm(8mil)
Min Trace Width: 0.5mm(19mil)
Min Trace Spacing: 0.25mm(10mil)
Surface Finishing: ENIG 5u'
Test: Flying probe
Panel Dimension: 110.00mX437.50mm/pcs
Panel Method: 1up, 1*1
Lead Time:fastest 5 wds,normal 8-13wds
Part Name: ME-PCB-197-01
Layer count: 8L
Material: FR4
Thickness: 1.60mm
Part Size: 335* 245/1 up.
Copper thickness : 1/1/1/1/1/1/1/1oz
Surface: HASL
Solder: Blue
Silkscreen: White
Special: hole copper 25um, blue solder mask
Layer count:20l
Base material: fr-4 tg170
Copper thickness: all layers 2oz
Board thickness: 3.2mm±0.3mm
Min hole diameter: 0.50mm(19mil)
Min trace width: 0.20mm(8mil)
Min trace spacing: 0.20mm(8mil)
Suface finishing: enig
Test: flying probe
Panel dimension: 106.63mmx134.42 mm
Panel method: 6up, 2*3
Blind:dr1-2, dr3-4, 2 step blind vias
Via diameter: 0.5mm(19mil)
Lead time:fastest 10wds, normal 15-20 wds
Layers count:4l
Base mateial: iteq tg180
Board thickness: 1.60±0.15mm
Min hole: 0.20mm(8mil)
Min trace width: 0.089mm(3.5mil)
Min trace spacing: 0.094mm(3.7mil)
Surface finishing: enig
Test: flying probe
Panel dimension: 157.00mmx409.55mm/pcs
Panel method: 1up, 1*1
Lead time:fastest 3wds, normal 5-7wds
