Silicon ingots, wafers.
With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
Snack, biscuits, cookies, wafer.
aTDS is composed together with EFEM, Wafer Transfer Robot for full automation in 300mm wafer analysis, and possible to be provided as core component of various options as well as QMS such as 100, 200, 300, 500 amu and so on according to the request of customer.
Silicon materials such as silicon wafers, broken wafers, silicon ingots, chunks, solar wafers, solar cell, and silicon granules..
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
MV-26(L) Wafer, Lever +Type of Body: Wafer +Flange: JIS 5K/10K,ANSI 150LBS,PN 6/10/16(BS 4504) +Operator: Lever +Material : - Body : Cast iron, Cast Steel, Ductile iron, Stainless Steel - Disc : Stainless steel, Aluminium bronze - Seat : EPDM, NBR, PTFE, SILICONE - Stem : Stainless Steel + OPTION : - Lug body - Flange body
MV-26(G) Wafer, Gear +Type of Body: Wafer +Flange: JIS 5K/10K, ANSI 150LBS, PN 6/10/16(BS 4504) +Operator: Worm Gear + Material:: - Body : Cast iron, Cast Steel, Ductile iron, Stainless Steel - Disc : Stainless steel, Aluminium bronze - Seat : EPDM, NBR, PTFE, SILICONE - Stem : Stainless Steel + OPTION - Lug body - Flange body
MV-26 Wafer, Lever
MV-27 AL, Wafer, Lever + Type of Body: Wafer +Flange: JIS 10K, ANSI 150, PN10 +Material : -Body : Aluminium alloy diecast (ADC-12) -Disc : Stainless steel (304, 316) -Stem : Stainless steel (304, 316) -Seat Ring: EPDM, NBR - Max. Temperature : EPDM: -20 c to +120 c NBR : -10 c to +80 c - Max. Pressure : 10 kg/cm2 (0.98MPa) -Body Shell Test : 15 kg/cm2 (1.47MPa) -Seat Leak Test : 11 kg/cm2 (1.08MPa) - Operator : Lock Lever (1-1/4 in~6 in) Worm Gear (1-1/4 in~12 in) +OPTION - Long bonnet
AV-14 AL, Wafer, Bare + Type of body: Wafer + Flange: JIS 5K/10K , ANSI 150, PN 10 + Material : _ Body : Aluminum Alloy Diecast (ADC-12) _ Disc : Stainless Steel (304, 316) _ Stem : Stainless Steel (304, 316) _ Seat : EPDM, NBR + Face to face dimension : _ ISO 5752, API 609, MSS SP-68, _ DIN 3203/K1 (short) + Top flange dimension : Bolt hole ISO 5211 + Light weight & compact + Max. Pressure : 10 kg/cm2 (0.98MPa) + Max. Temperature : EPDM (-20 c to +120 c) + Test : Body = 15 kg/cm2 (1.47MPa) / Seat = 11 kg/cm2 (1.08MPa) +OPTION - Long bonnet
Cell, silicon materials, solar modules, solar modules, solar wafers, solar wafers.
Solar panel, wafers scrap, silicon ingot, polysilicon.
Wafer carrier, etfe film.Shipping
AV-15,16 H/P Wafer 20K + Type of body: Wafer + Flange : ANSI 300 + Material : - Body : Ductile iron, Cast steel - Stainless steel (304, 316) - Disc : Stainless steel (304, 316 & 316L) - Stem : Stainless steel (304, 316, 316L & 630) - Seat ring : EPDM, PTFE, RTFE, Metal + Face to face dimension : - ISO 5752, API 609, MSS SP-68, DIN 3203 / K1 (Short) + Top flange dimension : Bolt hole to ISO 5211 + Stem dimension : Square drive to ISO 5211 + Double eccentric (offset) disc + Vacuum equipment (up to 10-5 Torr) + Max.Temperature : - EPDM : -20 c to +120 c - PTFE : -60 c to +160 c - RTFE : -60 to +200 c - Metal : -120 to +450 c + OPTION - Lugged body - Long bonnet
Dummy Wafer, Wafer Grooving Coating Materials, Uv Dicing Film, Quartz, Etc..
Confectioneries, waffle, wafers, pretzel, Korean mushroom, fresh vegetable, chocolate.
Food, Confectionery, Chocolate, Candy, Snack, Stone Chocolate.
