SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
