SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency
Usage of the products :
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Supplier: Organic fertilizers (agricultural products), ceramic items (kitchenware and other related products), industrial items for paper mills (e.g., nylon belts, ropes, sandwich blades, doctor blades, etc.)
Services: Taxation and accounting services, auditing services, fema, rbi, joint venture services etc.