Aluminum Nitride Suppliers and Manufacturers

MF: AlN Chemical Name: Aluminum Nitride Purity: > 99.99% APS: 100 nm (Size Customization possible) Form Nano powder Product Number: #NCZ401 CAS Number 24304-00-5

Product name:aluminum nitride Place of origin:hebei, china Brand name:ledphor Cas no.:24304-00-5 Formula:aln Formula weight:40.99g/mol Appearance(color/form):white/powder Size:d50

A960 Alumina offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its: Thermocycling capability, Thermal shock resistance, Flexural strength, Surface quality, Thermal conductivity. This makes A960 Alumina Ceramic Substrates ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB). ALN Aluminum Nitride - with outstanding insulating properties and extremely high thermal conductivity (â?¥ 170 W/mK), Aluminum Nitride is perfect for the extremely high performance required in the electronics industry. AlN ceramic enables the compact, affordable construction of components and hybrid designs with high integration density. Extraordinary mechanical strength and a low thermal expansion coefficient enable seamless system integration.

For a long time, AL2O3 and Beo ceramics have been used in most high power hybrid of IC circuit board materials, but the thermal conductivity and thermal expansion coefficient of AL2O3 substrates do not match with Si. Although Beo has excellent comprehensive performance, its high production cost and high toxicity limit its application and popularization. Therefore, considering the performance, cost and environmental protection, the two can not meet the development and demand of modern electronic power devices. Aluminum nitride ceramic with excellent comprehensive properties is a new generation of advanced ceramics which has received extensive attention in recent years. It has a wide application prospect in many aspects. Especially, it has the advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching with silicon and non-toxicity, making it an ideal material for high density, high power and high speed integrated circuit boards and packaging substrates.

Aluminum Nitride (AlN) ceramics and components,High thermal conductivity (theoretic value 280W/m.K),high electric resistance,low coefficient of heat expansion(4.5X10-6) good march with Si(3.5~410-6) and GaAs(610-6),Excellent electrical properties(Dielectric constant, dielectric loss, bulk resistivity, dielectric strength). features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. This makes aluminum nitride predestined for use in power and microelectronics applications. For example, it is used as a circuit carrier(substrate) in semiconductors or as a heat-sink in LED lighting technology or high-power electronics and renewable energy. AlN ceramic has following properties 1) High thermal conductivity ( 280W/m.K) (2) High electrical insulation capacity (>1.1012©cm) (3) Low thermal expansion (coefficient of heat expansion)(4.5X10-6)Good with Si(3.5~410-6) and GaAs(610-6) (4)Excellent electricity properties(Dielectric constant, dielectric loss, bulk resistivity, dielectric strength). (5) Good mechanic properties (6) Excellent corrosion resistance (7) Good optical transmission property Application Power Module Duo to its high thermal conductivity, high electricity resistance, excellent electricity properties Dielectric constant, dielectric loss, bulk resistivity, dielectric strengthAlN ceramics are widely applied to large scale IC package, silicon controlled rectifier,high speed conversion module,audio frequency and microwave power amplifier, photo-electron IC module, IGBT module, etc. LED Package AlN ceramics will replace traditional materials for high power LED substrates, becoming a preferred material for substrate. High Brightness LED (HBLED): UVLED (UVA, UVC): RF/Microwave communication Automotive Electronics Image Sensing

The variety of different powder size(2, 5, 10, 20 um) and surface treatment are definitely meeting customers requirement in all aspects. The ALNF extremely powder applications such aln substrate sintering, filler materials in thermal grease, MCPCB and EPOXY for potting on power, chip epoxy molding compound package material , epoxy potting in transformer coil bobbin. 2kg sample package, 25kg vacuum bag pack.

The high thermal conductivity and electrical insulating featured materials ALNF (k up to 320 W/M.K theoretically) for the strong demanding applications in industry thermal management. The variety of different powder size (2, 5, 10, 20 um) and surface treatment are definitely meeting customers requirement in all aspects. Custom is welcomed. The ALNF extremely powder applications such aln substrate sintering, filler materials in thermal grease, mcpcb and epoxy for potting on power, chip epoxy molding compound package material , Epoxy potting in transformer coil bobbin. 25kg bottle, vacuum packed.

LT1800 Aluminum nitride conductive ceramic sheet has high thermal conductivity 180W/m-k,one of the highest thermal conductivity materials in metallic materials (7~10 times of alumina ceramic sheet). Excellent mechanical properties, good processing, high precision, smooth surface, no microcracks, bending, etc. Low dielectric constant and dielectric loss, reliable electrical insulation performance. Non-toxic, high temperature of 1800 degrees, oil resistant, chemical resistant, and similar to the thermal expansion coefficient of silicon, without hygroscopic property, stable performance and high reliability in high temperature and high humidity. Along with the microelectronic devices, Features & Benefits: Extremely high thermal conductivity High temperature and high humidity Good insulation Good chemical stability Typical Applications: Application of optical communication devices High frequency microwave application Power electronic components LED industry Car electronic module The thermal module substrate For more , please kindly feel free to contact

LT1800 Aluminum nitride conductive ceramic sheet has high thermal conductivity 180W/m-k,one of the highest thermal conductivity materials in metallic materials (7~10 times of alumina ceramic sheet). Excellent mechanical properties, good processing, high precision, smooth surface, no microcracks, bending, etc. Low dielectric constant and dielectric loss, reliable electrical insulation performance. Non-toxic, high temperature of 1800 degrees, oil resistant, chemical resistant, and similar to the thermal expansion coefficient of silicon, without hygroscopic property, stable performance and high reliability in high temperature and high humidity. Along with the microelectronic devices, Features & Benefits: Extremely high thermal conductivity High temperature and high humidity Good insulation Good chemical stability Typical Applications: Application of optical communication devices High frequency microwave application Power electronic components LED industry Car electronic module The thermal module substrate For more , please kindly feel free to contact

Material: silicon nitride, zirconia, aluminum oxygen (Si3N4, ZrO2, Al2O3) Diameter: 1mm-40mm Application: they are widely used in aviation, spaceflight, navigation, petroleum, chemical industry, metallurgy, electric power, automobile, textile, machinery, pumps, medical equipment, etc.

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we can offer minimum 25000 tons aluminium prime ingots A7 price LME minus 15% CIF ASWP net payment LC sight irrevocable transferable payable at sight