Valve, cable & wire, electronic component, transmitter, isolator, thermometer, hygrometer.
Sports shoe, soccer shoe, football shoe, baseball shoe, golf shoe, skateboard, snow boots, special working shoe, sandal and slipper, canvas� shoe, dress shoe, safety wear shoe, mountain shoe.
Plastic squeeze tube, empty plastic tube, cosmetic packaging.
Dummy Wafer, Wafer Grooving Coating Materials, Uv Dicing Film, Quartz, Etc..
Plastic injection mold maker, molds for automobile and pallet and box and tv .
Galvanized wire rope.
Synthetic orthopedic casting tape & splint and under cast pad, casting equipment, casting resin, metal adhesive.
The Dumbbell style elements, with the enlarged cold ends, were one of the earliest designs of the heating elements, which were originally made oversized to increase the cold end cross section, lowering electrical resistance so as to lower the operating temperature of the cold ends. Following should be provided when inquiring or ordering DB (Dumbbell) Silicon Carbide Heating Elements: Type: DB Outer Diameters: of the Hot Zone (D1) and of the Cold Zone (D2), mm Length: of the Heating Section or the Hot Zone, HZ, mm Length: of the Cold Zone, CZ, mm Overall Length: OL, mm Example: Type DB, D1/ D2=18/28mm, HZ=300mm, CZ=350mm, OL=1000mm, Resistance 1.70�© Specified as: SPK DB18/28/300/350/1.70
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
we are one of the company producing the wallpaper paste(KOREAPUL). We are exporting our product KOREA PUL to southeast Asia, Canada, and Uzbekistan, and the product' quality is receiving much recognition. Execellent antibacterial properties evaluated by trusted party. Certification of Environmental Building Material NO. HB1300E12-01. National Housing Corporation Papering Glue Test Code- KSF3217 . Made of natural potato starch. Granulated, easily dispersed in water and convenient in storage and delivery. Transparent, clean looking applied glue can be achieved. Chemically stable and wrinkle doesn't occur. I'll be waiting for your reply.
Hand Sanitizers, Disposable Medical Protective Gowns, Goggles, Gloves And Other Anti-virus Products.
Motors, gears, compressors and all other metal scraps.Packing, shipping
