The Dumbbell style elements, with the enlarged cold ends, were one of the earliest designs of the heating elements, which were originally made oversized to increase the cold end cross section, lowering electrical resistance so as to lower the operating temperature of the cold ends.
Following should be provided when inquiring or ordering DB (Dumbbell) Silicon Carbide Heating Elements:
Type: DB
Outer Diameters: of the Hot Zone (D1) and of the Cold Zone (D2), mm
Length: of the Heating Section or the Hot Zone, HZ, mm
We work for the new tire business and our dealing brand new tires are Bridgestone and Micheline, Continental brand tires. Also we work with Hankook and Kumho brand tires as well.
1. Name of product : Bridgestone Micheline, Continental, Hankook, Kumho brand
2. Price : Please send us an inquiry
3. Product origin : Europe origin
4. Specification : Brand new condition tire with premium brand
5. HS Code : 4012 20 9010
6. Minimum of quantity : 20 or 40 container around 1,000units
Magnet Assy is located behind target, activated electronic motion in the plasma that improved efficiency by improving the uniformity of the deposition. Cathode role of the target material (Ti, Al, W, Ta, Cu, etc.) to be deposited on a substrate, pulls the Arion in plasma.
- Magnet assemblies are made up of steel parts and a ceramic magnet, bonded together with epoxy.
- Max pull is tested on a ½� thick and flat machined steel plate. But the actual pull should be much smaller if your steel is thinner, rough, rusty, coated or not very flat. For any critical applications, three-time safety factor is strongly recommended.
- Besides standard models listed bellow, we can make assemblies based on custom designs.
- Applications include magnetic holding, lifting, antenna mounting, positioning, retrieving and more.
Magnet Assy is located on the Target in deposition processing (PVD process) in pre-processing of the semiconductor wafer chips manufacturing.
Place the substrate(wafer)on the surface of the MCA E-chuck.
Its role is to create the thin film off the Target in a plasma vaccum with its magnetic force.
It has a significant role of the wafer thin film creating
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency
Usage of the products :
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel
Usage of the products :
Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel
Grinder Wheel for LED Process:
Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design.
Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality.
Wheel Life Time Easy adjusting design with priority in quality.
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials.
Usage of the product:
Resin Bonded Wheels can be effectively used in the brodest range of appliances.
Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used.
It is more excellent in bonding.
Strength than the Resin bond.
It can adjust its strength and chip discharging function by changing its porosity and Structures.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
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