We work for the new tire business and our dealing brand new tires are Bridgestone and Micheline, Continental brand tires. Also we work with Hankook and Kumho brand tires as well. 1. Name of product : Bridgestone Micheline, Continental, Hankook, Kumho brand 2. Price : Please send us an inquiry 3. Product origin : Europe origin 4. Specification : Brand new condition tire with premium brand 5. HS Code : 4012 20 9010 6. Minimum of quantity : 20 or 40 container around 1,000units 7. Packing is in Export packing.
We work mostly brand new premium brand tires such as Bridgestone, Continental, Micheline, Hankook, Kumho brand 1. Name of product : Bridgestone Micheline, Continental, Hankook, Kumho brand 2. Price : Please send us an inquiry 3. Product origin : Europe origin 4. Specification : Brand new condition tire with premium brand 5. HS Code : 4012 20 9010 6. Minimum of quantity : 20 or 40 container around 1,000units 7. Packing is in Export packing.
Magnet Assy is located behind target, activated electronic motion in the plasma that improved efficiency by improving the uniformity of the deposition. Cathode role of the target material (Ti, Al, W, Ta, Cu, etc.) to be deposited on a substrate, pulls the Arion in plasma.
- Magnet assemblies are made up of steel parts and a ceramic magnet, bonded together with epoxy. - Max pull is tested on a ½� thick and flat machined steel plate. But the actual pull should be much smaller if your steel is thinner, rough, rusty, coated or not very flat. For any critical applications, three-time safety factor is strongly recommended. - Besides standard models listed bellow, we can make assemblies based on custom designs. - Applications include magnetic holding, lifting, antenna mounting, positioning, retrieving and more.
Magnet Assy is located on the Target in deposition processing (PVD process) in pre-processing of the semiconductor wafer chips manufacturing. Place the substrate(wafer)on the surface of the MCA E-chuck. Its role is to create the thin film off the Target in a plasma vaccum with its magnetic force. It has a significant role of the wafer thin film creating
XTeer TOP PRIME is a premium performance engine oil formulated with state of the art additives and fully synthetic base fluids. XTeer TOP PRIME meets or exceeds the requirements of ï?² API SN ï?² ACEA C3-16 ï?² MB-Approval 229.31/229.51/229.52 ï?² VW 50200/50501 ï?² BMW Longlife â?? 04 ï?² GM dexos 2
XTeer Gasoline G700 is the most advanced synthetic gasoline engine oil designed for premium cars with the latest technology. It meets the requirements of current advanced engine oil grade of API SN and ILSAC GF-5. It is optimized to provide outstanding protection and lubricity in all passenger gasoline car engines. XTeer GASOLINE G700 meets or exceeds the requirements of API SN/GF-5
XTeer DIESEL Ultra is the most advanced synthetic diesel engine oil designed for protecting advanced engine parts as well as the environment. It meets the requirements of current advanced engine oil grade of API SN, ACEA C3. It is a 100% synthetic diesel engine oil utilizing advanced technology. XTeer DIESEL Ultra 5W30 meets or exceeds the requirements of - API SN - ACEA C3-16 - MB-Approval 229.31/229.51/229.52 - VW 50200/50501 - BMW Longlife â?? 04 - GM dexos 2
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Origin : Korea Capacity : 3,000MT/Month Analysis - SiO2 : 70.4% - Al2O3 : 16.0% - K2O : 10.2% - Na2O : 2.32% - MgO : 0.05% - CaO : 0.13% - Fe2O3 : 0.22% - TiO2 : 0.01%
Polycarbonate(Blue)
[ Hyafilia - Hyaluronic Acid Filler ] made by one of the biggest hospital group called, "CHA Hospital Group" Hyafilia is used for temporary improvement of wrinkles by injecting it into skin layer around the facial wrinkles. It is a colorless and transparent gel-type product with viscoelasticity composed of a stabilized non-animal hyaluronic acid. Hyafilia is tissue reconstructive material that intended to be used for facial tissue augmentation. It is recommended that the product be used for the correction of moderate to severe facial wrinkles, folds, and acne scars.
