Pcb, cpu, copper scrap, nickel, tungsten.
PTFE Scraps.
Jinsung Electronics is a company to lead manufacturing of Flex Printed Circuits and Rigid-Flex Printed Circuits with fast delivery and competitive price. 1. LAYER : 4 layer (FLEXIBLE 2 layer+RIGID 2 layer) 4-2-4 2. application : Industrial Equipment 3. Thickness : 1.2T 4. Structure : 1-4L DRILL 5. Machine Drill : Min. 0.25 mm 6. Cu Plating : Min. 25 micrometer / NORMAL PALTING 7. L/S : 100 micrometer / 100 micrometer
LAYER 4layer (FLEXIBLE 2layer+RIGID 2layer) 4-2-4 Application Industrial Equipment Thickness 1.2T Structure 1-4L DRILL Machine Drill Min. 0.25mm Cu Plating Min. 25 / NORMAL PALTING L/S 100 / 100 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER 4LAYER(FLEXIBLE 2L+RIGID 2L) 4-2-4-4 Application Industrial Equipment Thickness RIGID part 0.6T Structure 1-4L DRILL,1-2L,3-4L BLIND VIA Machine Drill Min. 0.2mm /HOLEPLUG+ CAP PLATING Laser Drill BVH Min. 0.1mm / PNL PLATING Cu Plating Min. 25 / NORMAL PALTING L/S 60/60 PSR GREEN Surface treatment ELECTRO HARD GOLD + ENIG
LAYER Double side FPCB + Partial PSR Application SENSOR Thickness CON. 0.2T L/S 125/125 LASER Drill 50 Copper plating Hole inner Min. 25 Inspection spec Not allowing damage on copper plating part SPECIAL item for controlling Stair-shape at Copper plating neighboring area Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
LAYER Double side FPCB + partial PSR + SUS + CBF Application CCM Thickness 0.3T L/S 60/60 DRILL/LAND 200/350 Copper plating Inner Hole Min. 18 Inspection spec Zero defect in SUS and appearance
LAYER 4Layer (FLEXIBLE 2L+RIGID 4L) 4-2-4-3-2 Application Blood Sugar Check Thickness 0.38T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.1mm Laser Drill BVH Min. 0.1mmSTACK VIA FILL copper plating Cu Plating INNER : VIA FILL / OUT : PTH Min.20+ VIA FILL L/S 50 / 50 (SPECIAL) PSR GREEN Surface treatment ENIG Stiffner PI (3Mil) Impedance 100
Aluminum extrusion, scrap.
Product Features: By adopting water-cooled apparatus was Plate improvement of the thermal deformation of Plate to the integration of the driving parts mounted on GEAREDMOTOR and VECTOR INVERTER SOFT START, SOFT STOP prevent chipping driving single side rapping an existing cross-section of a special design based on the weakness of the central abrasive removes congestion
Product Features: By adopting water-cooled apparatus was Plate improvement of the thermal deformation of Plate to the integration of the driving parts mounted on GEAREDMOTOR and VECTOR INVERTER SOFT START, SOFT STOP prevent chipping driving single side rapping an existing cross-section of a special design based on the weakness of the central abrasive removes congestion
LAYER 2layer [FLEXIBLE 1layer + RIGID 1layer] 2-1-2 Application Industrial Equipment Thickness 1.6T Machine Drill Min. 0.25mm Cu Plating HOLE Min. 20 L/S 400 / 100 PSR / COV BLUE / BLACK Surface treatment ENIG Impedance LAYER 1L Impeance spec 100
The blood of various steel and nonferrous metal tribute series caused burr removed after molding, chamfering, etc. Removal of scale that occurs after the heat treatment is ideal for plating or coating before finishing polishing, polishing is suitable for glossy
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
LAYER 4layer [FLEXIBLE 1layer + RIGID 3layer] 4-1 Application Industrial Equipment Thickness 0.5T Machine Drill Min. 0.25mm Laser Drill BVH Min. 0.12mm Cu Plating HOLE Min. 25 L/S 110/120 PSR / COV GREEN / YELLOW Surface Treatment ENIG Impedance LAYER 4L Impeance spec 50
LAYER 10LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 Application GPS Thickness 1.6T Machine Drill Min. 0.2mm Laser Drill BVH Min. 0.1mm Cu Plating HOLE Min. 25 L/S 100/100 PSR GREEN Surface treatment ENEPIG, ENIG Impedance LAYER 1L, 4L, 8L, 10L Impedance spec 50 / 100
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1 2. Application : Industrial Equipment 3. Thickness : 0.5T 4. Machine Drill : Min. 0.25 mm 5. Laser Drill : BVH Min. 0.12 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 110 micrometer/ 120 micrometer
