CONAP S-13 solvent and thinner is designed for dilution of CONAP CE-1170 conformal coating for both dip and spray applications. It contains powerful solvents but has a fairly short retention time. S-13 can also be used for cleanup.
CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the ultimate in humidity resistance and hydrolytic stability, while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding.
Adhesive.
Specialty adhesives, electronics/electric industry(cr rubber, ms silicon, rtv), audio(speaker) for car, amp, construction, automobile, hotmelt for dy(ul grade), general industry (pannel, shoe, leather, primer), lamination glue for paper bag, food package, high performance adhesives and sealants (electronic), smt glue(chipbond), threadlocking, epoxy potting, thermal conductive, encapsulants & coating, pu adhesive for coating, label special film & tape.
Polyester silicon adhesive tape, clean roll tape, polyimide adhesive tape, glass cloth tape.
