Description CAS No.1590-87-0 Applications Semiconductor Gas
Description Liquefied gas, Toxic, flammable, N.O.S. Applications HFB is used for critical dimension dielectric etch applications Higher SiO2 etch rates can be achived with better Selectivity. HFB is a Colorless, Odorless, and flammable liquefied gas
Description Halocarbon 218 (Perfluoropropane)(C3F8) is a colorless, nonflammable, nontoxic gas which is relatively stable and has a faintly sweet odor. Halocarbon 218 is shipped as a liquefied gas under its Own vapor pressure (103 psig@ 70° F). Applications Halocarbon 218 is used for plasma etching. The chemical composition of Halocarbon 218 supplies a higher ratio of Fluorine to Carbon than any Of the other Halocarbon gases supplied by Electronic Fluorocarbons LLC. When Halocarbon 218 is exposed to the RF field generated in the etch process, a gas plasma is produced that will etch Silicon Dioxide or Silicon Nitrite with exel lent selectivity.
Description 10% GERMAIN in H2 CAS No. 7782-65-2, UN No. 1954 , EU No. 231-961-6 Applications Semiconductor Gas
Description Flammable Liquid, N.O.S.;3(Flammable); UN 1993 Applications General Industrial, Synthetic & Analytical Chemistry
Description Chemical Name : Polyethylene Terephthalate (PET) CAS No.: 25038-59-9 Form : Granula Powder Applications Film Coati ngAgent
Description Chemical Name : Polyurethane beads CAS No.: 9009-54-5 Form : Granula Powder Applications Light Diffusion Film Coating Agent
Description Chemical Name : Nylon-12 CAS No.: 25038-74-8 Form : Bead Type Powder Applications Light Diffusion Film Coating Agent
Refrigerant.
R134a refrigerant gas.
Gas (Voltaix, Linde, EFC), Gasket (Localized), Seal (Parker), BEAD, FDT (Linde), industrial gas, Pigment.
