Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
LED material, semi conductor, grinding wheel.
Dicing Blade : Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process. Features of the product - Si Wafer Damage minimizing design - Productivity & Life Time optimizing designed.
Sapphire ( Led Material) : Usage of the products : Sapphire Ingot - Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel, Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Features of the product : Product Design with Priority in Quality, Processing and Productivity and Material Life Time Improvement - Machine & Material customized process optimization
Semiconductor : Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process Features of the product - Si Wafer Damage Relief design - Damage area minimizing design and Wheel design considering Ra - Guttering effect Wheel design
