UP-MP3 DIY learning platform, self-developed by UP-TECH fits for professional course design, graduation design in universities and MP3 fansÆ study and development. Computer learners are able to gradually finish the design and production of MP3. In the course of learning, it covers the comprehensive knowledge of singlechip, digital electronic line, circuit wafer design and production, C language procedures design. In addition, we offer detailed courseware whose operationability is wonderful, explaining in simple language results of a profound study, research etc. focusing on conception, and emphasizing train of thought and has low standard for learners. That fits for the students who are involved in practice projects such as extracurricular science & technology activities Matching Source: * Lecture PPT(PDF) * The teaching Audio of circuit wafer production * Some documents on USB agreement * Seventeen USB1.1 2.0 standards * Paper system and Mass Storage relative documents * Chip document:12 pieces :AS1117, 51, CS4330, LMV358, MAX3232, K9F5608 etc. * Software disk includes: Bushound, Flip, KeilC, Protel99, Source insight, serial debugging assiastance etc.
Up-Tech's classics UP-TECH S2410/P270 DVP teaching & scientific research system is the latest work of UP-TECH in 2008! It is the crystal of cordial feedback from the old and new clients across China and embodied Up-Tech's teaching experience of product development for years. It is compatible with the core CPU of Intel PXA270 and the all functions of the core CPU of S3C2410 from SamSung,, consideration overall development tendency of ARM platform, perfectly covers the full function of the series of ARM9 and Xscale from UP-TECH, becoming more elaborated and practical. Up-Tech's classics UP-TECH S2410/P270 DVP teaching & scientific research system is the result of the UP-TECH's experiences of embedded teaching product development for couple of years and it is so-called UP-TECH Classic Platform! Classic 2410 core board: * SAMSUNG S3C2410 CPU based on ARM 920T kernel,; the system works steadily with 202MHZ, MMU, AMBA available * 64MB SDRAM * 64MB N and Flash (larger capacity is optional) * One LED controlled by IO control * 2MB Nor Flash (optional) Classic 270 core board: * Intel PXA270 processor based on Xscale technology * 64MB SDRAM * the system stably works under the main frequency of 520MHZ * 64MB N and Flash * the internal integrates iwmmx instruction * 16MB Nor Flash Classic platform main board source: * 8+=640*480TFT real-color LCD * 8-channel 10-bit AD transfer * Touch screen * PS2 mouse keyboard connector ( MEGA8 extend) * IDE connector * 17-key digital keyboard ( MEGA8 extended) * four host USBs, ONE device USB * 2-bit LED digital tube * One 100M network card, with reserved other one 100M network * real-time clock * Two RS232 standard serials * IC card connector * One RS485 connector * CAN BUS connector * SD/MMC connector * 32-bit BUS and 168Pin extended connector of reusable source * CF card connector ( PC Card mode) * on-board UP-LINK JTAG debugger, with 20Pin standard emulator connector * AD transfer * VGA connector and video signal output * DA connector * DC electronic module( loop-locked test function) * IIC connector * two pieces of IIC memory * SPI connector * PWM DA output * IIS audio CODEC / AC97 audio CODEC * 8*8 matrix LED display module(CPLD drive) * stereo earphone, line, MIC connector * One keystoke producing interruption * Infrared communication IrDA * Three LEDs controlled by IO
UP-NETARM3000
Min.Line 0.076mm and min. Hole 0.076mm
Used main board For PC : Socket 370 , Socket 462 , Socket 478 For Laptop : IBM, DELL, HP, Compaq
PCB
Production model: 08i00004 Layer: 8 layers Process: immersion gold Finished thickness: 1.6mm Special show: Inner layer core board thickness : 0.2 mmú+ Inner layer w/s:4/4 milú+ Outer layer w/s: 4/6 milú+ Outer min drilling hole diameter :0.25 mmú+
Production model: 06i00003 Layer: 6 layers Process: immersion gold Finished thickness: 1.6mm Special show: gold finger board Gold thickness 32
PCB
Supply spindles and spindle parts manufacture to pcb drill or router machine. We have already obtained high reputation both for product's quality and service. Spindle repair service: spindle of westwind, hitachi, precise, jaeger, excellon, pluritec, posalux, schmoll, klingelnberg etc.: d1201, d1331, d1531, d1524, d1264, d1263, abw110, m320, abwr80, d1722, d1686, h501, h512, h912b, h910, h516, h916c, h920b sc63 tl60í¡ Discuss
The description of our product 1.Number of Layer: 2 to 20 layers. 2.Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg. 3.The color of soldermask and silkscreen, green, white, black, blue, yellow etc. 4.Surface finish: lead free hal, hal, flash gold, immersion gold, immersion tin, immersion silver, osp, gold finger plating, carbon ink printing, peelable blue mask. 5.The use of product:our products are used in a variety of electronic applications, including hand-phone motherboard,LCD of mobile,computer display card,blind&buried board,wireless router,medical equipment, MP4 players, DVD players ,GPRS,etc.
Material: FR-4 Layer Coverage: 2Layers Thickness: 1.6mm Surface Technique: Gold Plating Line Width/Space: 8mil/8mil Solder Mask Color: Red Special: Gold Finger--Chamferring
1 Number of Layer: 2 to 20 layers. 2 Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg. 3 The color of soldermask and silkscreen: Green, White, Black, Blue, yellow etc. 4 Surface Finish: Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask. 5 The use of product: Our products are used in a variety of electronic applications, including hand-phone motherboard, LCD of mobile, computer display card, blind&buried board, wireless router, medical equipment, MP4 players, DVD players, GPRS, etc. Production cycle: Sample: Double sided printed board: 2-4 days four layers printed board: 5-6 days Six to eight layers printed board: 6-7 days Product: Double sided printed board: 6-8 days Four to eight layers printed board: 8-12 days
Material: FR4 Layer: 1 Thickness: 0.8mm Surface treating: HAL lead free Solder mask: BLUE Min. Line/Space: 0.2mm Min. Hole: 0.3mm Lead Time: Only 2 days S. 5 m2, 10 days Profiling: Routing Copper: 1oz Electronical Test
Complete products contract pcb assembly and manufacturing service Circuit boards: 1 to 22 layers pcb layout, fabrication, and pcb assembly and box build
Pcb
Material : fr-4(high tg) Board thickness : 0.062" Layers : 6 Trace width/space : 5 mil/5 mil Via holes : 12 mil Application : sound system Vacuum package
$60 and 3 days ----- 10 pcs 2 layer pcb sample within 15 square inch! $200 and 6 days ----- 10 pcs 4 layer pcb sample within 15 square inch!
Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers Surface Finish: Immersion Tin Immersion Gold / HASL Finished outer Cu: 2 OZ Finished inner Cu: 2OZ Solder resist colour: Green Ident colour: White Special: BGA / Gold Finger
