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Material: FR4
Layer: 1
Thickness: 0.8mm
Surface treating: HAL lead free
Solder mask: BLUE
Min. Line/Space: 0.2mm
Min. Hole: 0.3mm
Lead Time: Only 2 days
S. 5 m2, 10 days
Profiling: Routing
Copper: 1oz
Electronical Test