Rigid Board

Fr4, high tg, all kind of surface finish, enig, immersion tin, LF HAL, ROHS. 25panel one pack

Material: fr-4+pi Layer count£º6 layer Board thickness:1.60mm Min line/space: outer layers:0.09/0.09mm Inner layers: 0.075/0.075mm

IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added

Multilayer pcbs Major material: fr-4, nelco, htg>170, high cti value, halogen free Minimum board thickness: Double sided: 0.2mm Multilayer: 0.4mm Maximum board thickness: Double sided: 2.4mm Multilayer: 3.2mm Surface finishing: Hal Lead-free hal Flash gold Selective gold Immersion gold (enig) Immersion tin Immersion silver Carbon print Gold fingers Entek (osp) Flux coating Peelable mask Gold plating (hard gold) Enig thick gold Solder mask plugged hole Copper finished thickness: 1/2 oz to 6 oz Minimum hole size: 0.25mm Minimum line width/spacing: 0.1 Standard: rohs, sgs, ukas, iso14001, dnv, ul We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Packing: vacuum packing

Konrich Technologies has been providing printed circuit boards (pcb) to our customers throughout the world for many years. With our rich experience in pcb manufacturing, we received a high recognition from customers. Good quality record, high on-time delivery rate and excellent customer service leaves a very good impression to our customers and also make us very competitive in the industry. With the advantage of our strong R&D, we can produce many types of pcb boards - normal single, double to multilayer boards, HDI as well Flex & Rigid-flex boards. Our pcb boards are widely used in many fields - Industrial control, Communication, Medical, Security, Consumer Electronics, etc.

1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1 2. Application : Industrial Equipment 3. Thickness : 0.5T 4. Machine Drill : Min. 0.25 mm 5. Laser Drill : BVH Min. 0.12 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 110 micrometer/ 120 micrometer

Rigid Flex Printed Circuit Boards: Layers : 4 Layer PCB Material: FR4 High Tg and polyimide Board Thickness: 1.6mm Surface Finishing: ENIG Finished Copper thickness: 1/1/1/1 OZ Special Process: Rigid-Flex PCB Rigid-Flex PCB Capability: Minimum Circuit Trace Width/Space: 2.7/2.7mil The Minimum Via Size : 0.15mm The Minimum legend Height/Width: 0.5mm/0.12mm Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide Maximum Panel Dimension: 1200mm x 600mm Final Board Thickness: 0.4mm ~ 6.0mm Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm Solder Mask Colour: Green White Black Red Blue Yellow Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole

Model : 10L Camera Module Rigid-Flex Board Material FR4 +PI Layer Rigid 4L + Flex 2L Copper Thickness 1OZ Finished Thickness 0.6mm Surface Treatment : Immersion Gold Min Hole :0.21mm Trace/Space :3mil/3mil

Model : 10L Camera Module Rigid-Flex Board Material FR4 +PI Layer Rigid 4L + Flex 2L Copper Thickness 1OZ Finished Thickness 0.6mm Surface Treatment : Immersion Gold Min Hole :0.21mm Trace/Space :3mil/3mil