Rigid-Flex PCB for Medical equipment
Laptop mainboard PCBA.
Aluminum Core PCB (Alu PCB)
From FPC prototype to flexible PCB mass production manufacturing, BETON PCBs factory has covered for all your flexible PCB(FPC) needs. Our knowledge and experience manufacturing this specific type of Flexible circuits board gives us a competitive advantages in the PCB industry. We also require no minimum product quantity on orders and always promise the best price and customer service with high quality Flexible PCB products provided to customers.
HDI Board HDI PCB Specification layer Count 12L Material ISOLA Board Thickness 2.4±0.1mm Stack-up 4+N +4 Aspect Ratio 12:1, 8mils Hole to Copper Blind vias L1L4 , L8L12 Micro-vias L1L2 , L11L12 Via-in-Pad Min. LW/LS 0.075mm Surface Finish ENIG We have over 17 years experience of HDI PCB baord production, and provide high quality HDI board to customers is our long term strategy, Any HDI Board projects need production please contact us freely
Model No.: LTCC3535,LTCC5050,3535,3028, Made in Taiwan, ROC Key Features Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate
Adopt f4bme high frequency material, osp, hasl, lf-hasl, enig, etc. Used in satellite, antenna, radar, etc.
For a long time, AL2O3 and Beo ceramics have been used in most high power hybrid of IC circuit board materials, but the thermal conductivity and thermal expansion coefficient of AL2O3 substrates do not match with Si. Although Beo has excellent comprehensive performance, its high production cost and high toxicity limit its application and popularization. Therefore, considering the performance, cost and environmental protection, the two can not meet the development and demand of modern electronic power devices. Aluminum nitride ceramic with excellent comprehensive properties is a new generation of advanced ceramics which has received extensive attention in recent years. It has a wide application prospect in many aspects. Especially, it has the advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching with silicon and non-toxicity, making it an ideal material for high density, high power and high speed integrated circuit boards and packaging substrates.
We are a unique name in the industry as a leading Supplier of Nitride Ceramic PCB in Wuhan, Hubei, China. Substrate type:aluminium nitride ceramics Conducting layer:Cu Surface preparation:immersion gold Metal single-sided / double sided:double sided Copper plated through hole:yes Solder mask:no
Backed by rich industry experiences, we are leading Manufacturer and Supplier of Customized Integrated Circuit Board in Wuhan, Hubei, China. Folysky Technology is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer�¢�?�?s expectations. Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications. Industry standard materials polished are 99.6% Alumina, 96% Alumina, AlN, BeO, Sapphire, Fused Silica. Centerline polishes virtually any ferrous or non ferrous material. Centerline Technologies�¢�?�? polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required
Wwe are manufacturer of single sided Printed Circuit Boards in India. We manufacture PCBs in FR4,CEM1, FR1,XPC in different thicknesses. We have the facility of CNC Drilling,Punching, BBT etc. We can give very competitive prices.
Specifications 1.Competitive Price, fast reply for RFQ 2.UL, ISO9001, ISO14001,ROHS Certificated 3.High Quality, 100% E-Testing OR Flying Probe Testing (100% Function Test Service ) 4. Free samples available Place of Origin: Guangdong, China (Mainland) Brand Name: ShenZhen DiHe Model Number: SZDH-Alu pcb-001 Base Material: Aluminum base Copper Thickness: 1oz Board Thickness: 1.6mm Min. Hole Size: 0.2mm Surface Finishing: HAL Lead Free Wrap and twist:: â?¤0.75% Standard:: IPC-A-6012 Service type: printed circuit board manufacturing (One-stop turnkey service) Insulation thickness: 100-150um Break-down voltage: AC 3.5 OR 6.0KV Withstand voltage: DC 3.0 OR 4.0KV Flammability: t1: 0, t2: 0 Glass Transition Temperature: 130 â?? Dielectric Constant 1MHZ: 5.2 Thermal Stress: 288â??>120S Heat Resistance: 0.6-0.8â??/W CTI: >600V Thermal Conductivity: 1.3, 1.6, 2.0, 3.2W/m.k Packaging & Delivery Packaging Details: Anti-static(vacuum) package with high quality carton box Delivery Detail: 5-7days
========= IC693PWR331 IC693MDL655 IC693ALG223 IC693CHS391 HIEE400961R001 3BHD002687R0534 3BHE014135R0011 3BHE014185R0002 3BHB002482P201 3BHE023584R2056 3BHE014135R0001 3BHE014185R0001 HIEE300308R0001 HIEE400923R0001 3BHE02358R2060 1769-L33ER 1769-OF4CI 1769-IF4I 1769-OW16 1769-IM12 RTAC-01 1756-CNBR 1756-PA75 1756-ENBT 1756-OW16I 1756-CN2R 1756-DNB 1769-OW16 =============
Overview Quick Details Place of Origin:Guangdong, China Brand Name:FS Model Number:94v0 pcb Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3 Copper Thickness:0.3oz-6oz Board Thickness:1.6mm Min. Hole Size:0.1mm Min. Line Width:0.15mm Min. Line Spacing:0.15mm Surface Finishing:HASL Lead Free, Immersion gold Layer:1-12 layers (include Rigid-Flex PCB) Certification:ISO/UL/RoHS/TS16949 Board Thickness Tolerance:5-10% Copper Weight Tolerance:±0.15 oz Flame resistance:94v0 Service:One stop service Testing Service:100% E-testing MOQ:1pcs Standard:IPC-A-610D Type of Assembly:PCBA Smt Assembly PCB Prototype Packaging & Deliver: Selling Units: Single item Single package size: 10X10X10 cm Single gross weight:0.45 kg Package Type:ESD Packaging with Carton Outside. Vacuum Packaging with Carton Outside. Fiberglass Fr4 Material 2layer Custom PCB Board Fabrication Picture Example: package-img package-img Lead Time : Quantity(Piece) 1 - 100 101 - 1000 >1000 Est. Time(days) 5 8 To be negotiated
PCB Cleaner, SMTfly-210 Machine description: SMTfly-210 pneumatic PCB auto cleaning machine is designed to clean misprint solder paste, squeegee, feeder partgs, a small amount of PCBA. Driven by compressed air, the machine clean PCB from upper and lower side, by â??one buttonâ?? wasy operation, the machine complete â??clean+dryâ?? process automatically; Special pump and paten designed rotation pod guarantee stable jet pressure to make sure efficient and high qualit cleaning result. Machine Feature: 1. SUS304 machine structure, resist acid and alkali corrossion, 10 years life time 2. Totally driven by compressed air, no electric power, totally no fire or explosion risk caused by electrical spark 3. One button easy operation, clean and dry complete automatically 4. Push-pull cleaning bastket, easy to put and take out cleaning parts, no need special jigs 5. Equipped auto liquid fill in and drain function 6. Inner-lock safety door, once open, machine stopped immediately to ensure operator safety 7. 3 level precise filtering system to make liquid clean by recycled used. 8. Super well-know pneumatic parts from all over the word ensure stable using of the machine 9. Modular design, easy maintenance Machine Specification: Item Parameter Max stencial size 420*420*200(mm) Liquid tank Max:50L, Min:20L Clean time 3-6min Dry time 4-6min Air supply 0.5-0.7Mpa Air consumption 200-600L/min Clean type 360°rotate jet clean+compressed air blow dry Filter system 20/5/1um(3 levels) Machine weight 205kgs Machine size 1060*800*1600mm
Product features: The ceramic circuit board has high accuracy and good electrical and thermal properties 2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole 3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology 4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced 5. Customized production, without mold opening, short production cycle 6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life. 7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment. 8. High frequency loss, it can be used in high frequency circuit. 9. Copper sealing, high reliability. 10. 3d substrate and 3d routing. 1. Ceramic circuit board appearance size is not limited 2., ceramic laser printing, three-dimensional routing 3. Ceramic circuit board without mask, fast response 4. Ceramic circuit board technology is mature, environmental protection, pollution-free
Today ceramics are already widely used as substrates in many microelectronic components and power led packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are chip-on-board (cob) modules, high power circuits, proximity sensors, battery drivers for evs, - . Ceramics advantages over other printed circuit boards: Lower expansion coefficient Good thermal properties Superior high frequency performance Lower system cost: reduces test, insertion, assembly Smaller package size due to integration Cost effective for dense package due to parallel processing of layers Hermetic packages possible, 0% water absorption
High ceramic PCB thermal conductivity is probably the leading reason more industries are turning to ceramics in their printed circuit boards and packages, as this material has a clear edge over plastics in this regard. Better CTE matching and hermetic sealing only add to the appeal of these materials. The challenge is that these materials, and the boards your ceramic PCB manufacturer makes from them, are considerably more expensive than materials for traditional printed circuit boards, which can add up significantly over the length of a high-volume job. However, the benefits of ceramic boards and the need for heightened thermal conductivity is so great, any company in a relevant industry that can afford to use ceramic boards will probably do so out of necessity. While we can have an estimate of the level of thermal conductivity each ceramic board can provide, the final values will vary depending upon the manufacturing process, in addition to grain size and composition. We can offer a range of values that experts seem to agree upon. Thermal conductivity for one of the most popular, although expensive ceramics â?? aluminum nitride â?? is one that many identify as over 150 W/mK, usually around 180 W/mK. However, studies find values ranging all the way from 80 W/mK to 200 W/mK at room temperature, with values dropping by more than one-third as you approach 100 degrees Celsius. Other thermal ranges we can identify at room temperature include 18-36 W/mK for aluminum oxide, 184 to 300 for beryllium oxide, 15 to 600 for boron nitride and 70-210 for silicon carbide. Because the variations are so wide, it is difficult to pin down actual thermal conductivity numbers. Your best approach will be to do your own testing, record the values you obtain and use those in your future calculations.
Product parameters Substrate typealumina ceramics Substrate material thickness0.5mm Conducting layercu Thickness of metal layer35m/35m Surface preparationheavy silver Metal single-sided /double sideddouble sided Copper plated through holeyes Solder maskyes Product features 1.High precision, good electrical and thermal properties, high bonding strength of. 2.Good weldability, blind hole through hole can be realized 3.Mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4. A wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5. Customized production, without mold opening, short production cycle. Company profile Folysky technology (wuhan) co., ltd., is a professional engaged in the plane, three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production, sales as one of the high-tech enterprises, which owns the well-known brand of ceramic circuit substrate -- slitong.
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