Aluminum PCB 1 layer normal thermal conductivity 1.5mm 1oz OSP Black mask Widely used in LED lighting manufacturing.
4 layers PCB FR4 1.6mm 1oz lead free HAL BGA Gold finger Green mask White ledgend.
Finished board thickness: 0.4-2.5mm Min. inner thin core thickness: 4mil Working panel size:Max: 20 X24 Min: 10 X10 Layer to layer registration: +/-2mil Drill hole size: 0.25~6.5mm Min. Finished hole size: 8mil Drilling true position tolerance: +/-2mil Drilling hole tolerance: +/-3mil(PTH); +/-2mil(NPTH) PTH thickness: Min. 1.0mil Plating Aspect Ratio: 7/1 Solder Mask registration: +/-2mil Min. outline tolerance: +/-4mil Min. G/F chamfer angle: 20 Finished board thickness tolerance: +/-4mil Impedance tolerance: +/-8~15%ohm Bow & Twist:
- 1 to 30-layer FR-4 PCBs with HDI, Aluminum based PCBs, Copper based PCBs & Iron based PCBs; - Prototype and mass production of High-Mix, Medium or Low-Volume orders. Air-tight poly bubble bag.
We are specialized in the production of high density Circui board, buries the blind orifice, supple (soft) natural line board enterprise. organized in March, 2002.The company organizes the initial period, the total investment is 5,000,000 Yuan, design productivity is 2200 square meters/months. But the company for suits electronics industry the need to develop, in line with has the development guiding ideology year by year, depended upon own strength success to realize the steady management, developed with steady steps strategic target.To at the beginning of 2003, company's total investment has amounted to 10,000,000 Yuan, the company from US, Japan, Germany, Israel has successively waited for the purchase advanced production equipment, promoted the production to measure buried the hole manufacture, flies the needle test technology to be in the lead in the profession, researched and developed the team through the company the unremitting endeavor, already succeeded the research and development to complete the laser micro eyelet, the high aperture ratio, the high layer back board, the high accuracy impedance, HDI and so on many kinds of leading production technology. The smallest aperture may reach ¦Õ0.15mm, smallest line width 3mil, smallest line-spacing 3mil. The company produces the electric circuit board product widely applies in domains and so on computer,communication,automobile, medical equipment, photoelectricity instrument, measuring appliance, electrical appliances, toy, the customer proliferates domestic and foreign our company equipment as well as material already comprehensively through ROHS authentication!
Our PCB Production Capability for your reference 1) Layer: from 1 to 20 2) Board finished thickness: 0.5-6.0mm 3) Material: FR-4,CEM-1, CEM-3, High TG, FR4 Halogen Free, etc 4) Surface finish/treatment: HASL/HASL lead free, HAL, Chemical Gold/tin, Immersion Silver/Gold/Tin, OSP, Gold plating, Hard &Soft gold, Plating tin. 5) Product range: Flex-PCB, Rigid-PCB, Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers, High frequency PCB ,etc 6) Max. finished board size: Single & Double Layer:450mm*650mm Multilayer:450*500mm 7) Min. drilled hole size: 3mil(0.075mm) 8) Min. line width: 3mil(0.075mm) 9) Min. line spacing: 3mil(0.075mm) 10) Solder mask color : Green/yellow/black/white/red/blue 11) Copper thickness in hole: >20.0um (1mil) 12) Shape tolerance: plus or minus 0.13 13) Hole tolerance: PTH: plus or minus 0.076; NPTH: plus or minus 0.05 14) Certificate: UL,ISO9001,ISO14001,SGS,RoHS compliance 15) Special req. Buried and blind vias +controlled impedence +BGA 16) Profiling : Punching ,Routing ,V-CUT, Beveling. Inner: Vacuum packing/Plastic bag Outer: Standard carton packing.
Enterprise's development, the key depends on the human, the company implements throughout ¡°humanist¡± the policy. One, established set of quantities only then to hire, decided the reward according to the duty, according to ability, contribution reward fair, fair personnel management mechanism and wages assignment pattern, has broken the region, the status boundary and the dear ones fetter, stimulated all staff the host consciousness which was own enterprise fights bravely; Two is the self-raise higher management and the engineers and technicians; Three, takes staff's training, organizes the staff to study underthe new form regularly the electronic technology development request. The product quality is company's life, in order to enable the company the product to adapt the electronic technology rapid development high quality request, the company has also established the perfect staff post responsibility and the work direction, formed a set to have the modern characteristic, the science document management system. Date delivery ability reaches 100 varieties, the month variety reaches, 4000 kinds, the area amounts to 10000 square meters. Manufacture experience rich staff for customer body custom make model. The double kneading board fast processing may complete in 24 hours, may amount to for 48-72 hour 4 to 8 plywood processing cycle, supports the customer project research and development advancement stably, the occupation city machine. Also may which provides according to the customer copies the board according to the customer PCB schematic diagram design wiring or the model.The design wiring or the model.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc). 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK. HDI Item Mass Production Prototype HDI structure 1+N+1,1+1+N+1+1 2+N+2 Buried hole Filled Filled Aspect ratio 0.75:1 0.75:1 Minimum laser hole 0.1mm(4mil) 0.1mm(4mil) Minimum laser pad 0.25mm(10mil) 0.25mm(10mil) Blind hole No filled No filled Rigid & Flex board NO YES Press fit hole YES YES Control Depth drilling YES YES Lead-free & Halogen-free YES YES Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm Immersion Tin 0.6-1.2µm 0.6-1.2µm Immersion silver 0.2-0.6µm 0.3-0.6µm OSP 0.1-0.4µm 0.25-0.4µm HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm. HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK .
LEAD Free HASL1 Layer / Single Side, Rigid PCB/PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with lower price than double side PCB. Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA: 1) Base material: FR-1(94v0), FR-4, CEM-1, 2) Max Board size: 600*600mm 3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm 4) Copper thickness: 0.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz 5) Special tech: BGA, PTH, Blind and buried vias 6) Profile: V-scoring, V-cutting, punching, etching, milling, routing 7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating) 8) With best price to USA, South American, India, South Africa and Europe 9) Main market: USA, EGYPT, Europe, South American, mid-east 10) Compliant: UL, ROHS, ISO9001-2000 11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II 12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical quipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night. 13) Small quantity and prototypes acceptable. 14) Lead time: 5-7days for prototypes, 9-13days for mass production. 15) Available Service: OEM, 24hrs service for fast prototype. 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & H.
OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with competitive price. Specifications of OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA: Layer 2 Finished Board Thickness 1.6mm Material FR-4 Min. Drilled Hole Size 3 mil(0.075mm) Min. Line Width 3 mil(0.075mm) Min. Line Spacing 3 mil(0.075mm) Surface Finish Plating/Immersion Gold Copper Thickness 10.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz OZ Solder Mask Color Blue/Red/Green Copper Thickness in Hole >25.0um (>1mil) Inner Packing Vacuum Packing/Plastic Bag Outer Packing Standard Carton Packing Shape Tolerance +/-0.13 Hole Tolerance PTH: +/-0.076 NPTH:+/-0.05 Certificate UL/ISO 9001, ISO14000, SGS, ROHS Special Requirements Buried and blind vias + controlled impedance BGA Profiling Routing, V-CUT, Beveling 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & HK.
1) Layer: from 1 to 20 2) Board finished thickness: 0.5-6.0mm 3) Material: FR-4,CEM-1, CEM-3, High TG, FR4 Halogen Free, etc 4) Surface finish/treatment: HASL/HASL lead free, HAL, Chemical Gold/tin, Immersion Silver/Gold/Tin, OSP, Gold plating, Hard &Soft gold, Plating tin. 5) Product range: Flex-PCB, Rigid-PCB, Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers, High frequency PCB ,etc 6) Max. finished board size: Single & Double Layer:450mm*650mm Multilayer:450*500mm 7) Min. drilled hole size: 3mil(0.075mm) 8) Min. line width: 3mil(0.075mm) 9) Min. line spacing: 3mil(0.075mm) 10) Solder mask color : Green/yellow/black/white/red/blue 11) Copper thickness in hole: >20.0um (1mil) 12) Shape tolerance: plus or minus 0.13 13) Hole tolerance: PTH: plus or minus 0.076; NPTH: plus or minus 0.05 14) Certificate: UL,ISO9001,ISO14001,SGS,RoHS compliance 15) Special req. Buried and blind vias +controlled impedence +BGA 16) Profiling : Punching ,Routing ,V-CUT, Beveling. Inner: Vacuum packing/Plastic bag Outer: Standard carton.
Printed circuit board.
Double Sided Multilayer Min Pref Min Pref Min Track Width 0.005 0.008 0.005 0.008 Track To Track Spacing 0.005 0.008 0.005 0.008 Min Drill Size 0.008 0.020 0.008 0.020 Min Annular Ring 0.006 0.010 0.010 0.012 Bare Board Test(flying Probe) 0.006 0.006 Router Tolerance 0.010 0.010.
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1/1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
