Double Sided Multilayer
Min Pref Min Pref
Min Track Width 0.005 0.008 0.005 0.008
Track To Track Spacing 0.005 0.008 0.005 0.008
Min Drill Size 0.008 0.020 0.008 0.020
Min Annular Ring 0.006 0.010 0.010 0.012
Bare Board Test(flying Probe) 0.006 0.006
Router Tolerance 0.010 0.010.
Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with quick turn prototypes. Main parameters: 1). Material: FR-4, High Tg FR-4 2). Layer count: 2 -16 Layer, 20 m PTH 3). Thickness: 0.5-1.6mm +/- 10% 4). Copper weight(Finished): 18-35 m 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.3mm minimum, 4/4 mil track/space 7). Pads finish: HASL, HASL Pb 8). Delivery time (calendar day) 2 Layer -- 1 days 4 Layer -- 3 days 6 Layer -- 5 days 8 Layer -- 5 days 10 Layer -- 7 days 12 Layer -- 10 days 14 Layer -- 12 days 16 Layer -- 12 days. Packing: vacuum bag and carton box outside. Max. 25kg/ctn.
Multilayer PCB consist of 3 or more circuit layers bonded together by a thickness of insulating material called prepreg and core. Multilayer printed circuit boards are most complicated than others, and are generally considered to be the most sophisticated PCB product due to their construction methods and design complexities. These are a few of the applications using multilayer printed circuit boards: Communications industrial controls GPS technology Aerospace Computers Military Medical Satellite systems General specification for Multi-layer printed circuit board 1, 4-38 layers 2, Board finished thickness: 0.3mm-7.0mm 3, Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers, Telfon. 4, Max. Finished board size: 23*25(580*900mm) 5, Min. Drilled hole size: 6mil(0.15mm) 6, Min. Line width: 3mil(0.075mm), Min. Line spacing: 3mil(0.075mm) 7, Surface finish/treatment: HASL/HASL lead free, Chemical tin, ENIG,Immersion Silver, OSP, etc. 8, Copper thickness: 0.5-20 oz 9, Solder mask color: Green/yellow/black/white/red/blue 10, Copper thickness in hole: >25.0 um(>1mil)
Main Material: FR-4, High TG135TG155,TG170, Aluminum Base, High Frequency,AL203 CCL Brand: Shenyi, KB, ITEQ, ISOLA, NANYA,ROGERS Sample Layers: 1-38L Mass Production: 1-24 Layers Surface Finish: LF HAL, HASL, Immersion Gold/Tin/Silver Technology: Gold Finger, PeenLble, Carbon Ink ,Impedance Control BGA,HDI Min Hole Size: 0.18mm Min Line Width: 0.076MM Min Line Spacing: 0.076MM Outline: CNC Routing, Punching, V-Cut Place of Origin: Guangdong, China (Mainland) Brand Name: IBE OEM Mounting Production: 6 SMT Lines Through Hole Production: 2 DIP Lines Enclosure Assembly: 2 Assembly Lines Certification: UL 94V0, ISO 9001 Environmental Compliance: REACH, RoHS, CMRT, PB-Free Specifications: Top PCB PCBA Electronic Manufactur Standards: IPC-A-610 E Class II-III Package: Vacuum Skin Double-Sided
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1/1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 7mils/7mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
Min.trace W/S: 3/3mil Max.layer count: SS, DS to 32L Max. working PNL size:21"x24" Material: FR4, Hi-tg, CEM-1, CEM-2 and more Impedance Control & Surface finish. We ship by UPS and Fedex, sample orders.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
Supplier: Quick turn PCB
Supplier: PCB
Services: OEM & ODM, pcb quick-turn service, pcba assembly service, pcb smt service, pcb soldering service