Pcb With Bga

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

6L, BGA-Multilayer PCB 6 Layer PCB Board, BGA PCB, Multilayer PCB, Special Technology PCB, Metal Core PCB, High-Level HDI Hole Technology, Blind Buried Hole PCB, Impedance Control PCB Supplier Layer/Board thickness: 6L/1.6mm Suface Finish: ENIG Trace/Space: 5/6mil Smallest Hole Diameter: 0.2MM PCBMAIN provides special technology PCB with high-level HDI hole technology such as metal core PCB, blind buried hole PCB, impedance control PCB, BGA PCB and multilayer PCB such as 6 layer PCB board, 4 layer PCB board, , 8 layer PCB board, 10 layer PCB board, 12 layer PCB board.

Layer: 1 to 32 layers Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers Board thickness: 0.21mm to 7.0mm Copper thickness: 0.5 OZ to 7.0 OZ Copper thickness in hole: >25.0 um (>1mil) Max. Board Size: 23 ¡¨¢ 25 (580mm¡¨¢900mm) Min. Drilled Hole Size: 3mil (0.075mm) Min. Line Width: 3mil (0.075mm) Min. Line Spacing: 3mil (0.075mm)

Number of layer: 1-56L Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc. Copper weight: 0.5OZ-6OZ(18mil-210mil) Board thickness: 0.2-7.2mm(8mil-282mil) Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc. Silk screen: White, blue, black, etc. Solder mask: Green, black, red, blue, yellow, white, etc. Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc. Test: Fly Probe test, fixture test Performance test: 100% electricity performance test Min hole size: 0.2mm, Laser 0.1mm Min line width/Space: 3mil/2mil Outline profile: Rout, V-cut, Bridge, Stamp hole Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer Min panel size: 10*10mm Hole center position tolerance: ±0.05mm

Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's. It covers: 1) 4-32 Layers, 0.5-6mm thick 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn prototype 10) Small and volume production. Vaccum bags.

The PCB design capabilities of Lepos are as follows: Maximum designed layers: 22 layers Maximum PIN count: 48963 Minimum via: 8 MIL (4 Mil laser hole) Minimum line width: 2.4 MIL Minimum line spacing: 4 MIL Maximum BGA count in a single PCB: 44 Minimum BGA PIN pitch: 0.4 mm Highest speed signal: 10G CML differential signals. Shortest lead time: 6 days for SI, placement, routing for 20000 pin PCB.

Bicheng provides RD, high-tech, IT research companies and organizations, large and small with PCB prototypes. It covers: 1) 1-32 Layers, 0.3-6mm thick, Heavy copper (2-10 oz) 2) High Tg 170, High CTI 600V 3) Impedance control +/-10% 4) 1+C+1 HDI, Buried/blind vias 5) Half hole, Via in pad, countersink hole 6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask 7) Rogers and FR-4 combination PCB. 8) BGA, CSP, QFN 9) Quick turn delivery 10) MOQ: 1 PCS. Packing: Vacuum bag and carton box outside Max. 25kg/ctn.

Supplier: PCB, FPC, MCPCB, BGA, HDI, double side, multilayer

Circuit Board Assemblyï¼? Chip-on-board (COB) Surface-mount technology (SMT) Ball-grid array (BGA) Through-hole Advantages: One-stop service included PCB fabrication and PCBA. Components sourcing Cost-effective Min order 1 pcs PCB Assembly Capabilityï¼? The Minimum PCB Dimension: 50x40mm The Maximum PCB Dimensionï¼?600x400mm The Maximum Component Height: 25mm The Maximum PCB Weight: 3KG The Minimum Components Size: 0201(0.5Ã?0.25mm),Flip-CHIP,QFP,BGA,POP The Maximum Components Size: 55mm The Minimum PCB Dimension: 50x40mm The Maximum PCB Dimension : 510x460mm The BGA/QFP pitch :0.3mm Testing: ICT, Burn-in, Function Test,Temperature Cycling The Lead time of PCB assembly: 7-10 WDS About King Sun PCB: King Sun PCB Technology is a manufacturing enterprise that be engaged in high density interconnector multilayer, various types PCB prototype, small and mass production PCB produce. Our products included: HDI PCBs, Via in PAD PCBs, ENEPIG PCBs, Castellated Holes PCBs, Small BGA ball PCBs, Heavy copper foil PCBs, High Frequency PCBs, Rigid-Flex PCBs.Products are used in wide range of IoT industries, Hi-Tech industries, Power supply, Telecommunication, Computer, Industrial control, Digital products, Science and Education instruments, Medical instruments, Automobile, etc. In 2005,we expanded our products to develop and manufacture metal core base PCBs(MCPCB) ,now commonly used in LED lighting and Automobile industry. MCPCBs first class material ensure reliability and play a major role in excellent heat dissipation. It greatly increase longevity of LED Lighting. now we have gained reputable recognition in famous LED Lighting companies. King Sun concentrates on high quality, fast and satisfied service in summary, our service offering are: ï?§ Quick-turn around prototypes fabrication. ï?§ Low cost for mass productions orders. ï?§ MCPCB fabrication. ï?§ PCB prototype assembly ï?§ Function test after PCB assembly ï?§ Stencil making ï?§ Components source