The legendary OREO sandwich cookies is an American cookies that dates back from the early 1900s.
AVAILABLE SIZE (Quantity/Carton) :
*Oreo Sandwich 119.6gr (24 Pcs)
*Oreo Sandwich 135.3gr (24 Pcs)
*Mini Oreo Cup 61.3gr (24 Pcs)
*Mini Oreo Pouch 20.4gr (10 Pcs x 6 Box)
*Oreo Wafer 117gr (24 Pcs)
*Oreo Softcake 16gr (12 Pcs x 12 Box)
*Oreo Sandwich Cookies 27.6gr (12 Pcs x 12 Box)
Variant: Vanilla, Strawberry, Chocoltae, Dark & White Chocolate, Penute Butter & Chocolate, Ice Cream Blueberry, Red Velvet
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*Big Range More Than 1000 items, So You Can Mix The Product
*FCL, Mix Container Load (Dry/Reefer) are welcome
*Shrink Wrapping and Other Special Packaging Arrangements are available
-Any Inquiry or need more details about product? feel free to contact us-
Product name: 2-12 Inch Orientation 100/111/110 SSP Prime/Dummy Grade Silicon Wafer
Place of Origin: China
Material: Silicon
Diameter:2-12 inch
Thickness: 100-1500um
Orientation: 100/110/111
Type/Dopant: intrinsic or P/B or N/Ph
Grade: prime/dummy
Bow/Warp:
100% brand new and high quality
Can be safely washed in the dishwasher or wiped clean
Roll up bib for easy travel and storage
Has a built in crumb catcher and adjustable clasp
For use on babies 6 months and older
All products have been tested for safety
These silicone bibs do not contain lead, bpa, phthalates, latex, or pvc
semiconductor si wafers
prime grade/high quality
diameter from 2" to 12"
ultra thin or ultra thick
crystalline orientation <100>, <111>, <110>
most resistivity range
Bondatek provides ge, gaas, gap, gan, gasb, inp, inas, insb wafers to micro- electronics and optoelectronics industry in diameter range from 2" to 4" with orientation<100> or <111>, epd< 5000 cm-2 and epi ready surface.
High quality and good surface quality to meet the updating request of pv development and reduce the production cost.
Crystal structuremono-crystalline
Crystal method cz
Conductance typep
Dopant b
Dimension125*125ía0.4156*156ía0.4
Diameter ª¦150ía0.4 ª¦165ía0.4ª¦200ía0.4
Crystal orientation <100>ía1
Resistivity( ª+.Cm) 1-3/3-6
Lifetime( ª8s) í²15
Carbon concentration( atoms/cm3 )ín5*1016
Oxygen concentration( atoms/cm3 )ín0.95*1018
1.Material: multicrystalline silicon
2.Growth method: directional solidification
3.Conductivity type: p-type (boron doped), astm f42
4.Oxygen concentration: n 1, 0x1017 at./cm3, astm f 121
5.Carbon concentration: n 1x1018 at./cm3, astm f 121
* oxygen content measurement by astm 1188 and used calculation coefficient for ppm atomic is 4, 9 and and for at/cm3 is 2, 45e+17.
6.Square side: (156.0 0.5) mm
7.Symmetry as per the drawing in the enclosure no. 1
8.Thickness: (200 30) µm, astm f 533
9.Ttv: < 50 µm, astm f657
10.Bow < 50 µm, astm f 534
11.Surface saw damage depth µm < 20 (< 15 typically)
12.Saw traces µm <5
13.Resistivity: 0.5 ¿c 2.0 Ω•cm, astm f 43
14.Minority carriers lifetime: > 2 µs, astm f 28
15.Surface: as-cut and cleaned; visible contamination, oil or grease, finger prints, soap stains, slurry stains, epoxy/water stains, cracks are not allowed; edge chips under 1 mm from the edge of the wafer are allowed.
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16.Customer may request to receive reference samples
17.Wafers are being stacked into batches of 50-100 wafers each. Then it is sealed into polyethylene film. Protective paper among wafers is upon customer request. 500 -600 wafers in total are being packed into styrofoam box. Styrofoam boxes are being packed into pasteboard cases. Wafers are being packed in such a manner as to ensure minimal damage to the product during transportation.
18.All polystyrene boxes of wafers are identified with: box number; type of wafer; number of wafers per box; all contributing ingots numbers; thickness of wafers; date of packing / output inspection.
Geometry:
Square side angle:900, 5
Chamfer: 1, 5 mm0, 5mm at 452
