Conventional Grinding Wheel for grind Stainless Steel coating Description of the Conventional Grinding Wheel for grind Stainless Steel coating: Conventional Grinding Wheel for grinding Stainless Steel coating is mainly used for grinding Stainless steel and different types of steel work-pieces. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes, dish shapes, etc. Feature/Benefit of the Conventional Grinding Wheel for grind Stainless Steel coating 1. Good free-cutting 2. Good Abrasion Resistance 3. Suitable for wet grinding wheel
Vitrified bond Diamond Grinding Wheel for Tungsten Carbide Coating Description of the Vitrified bond Diamond Grinding Wheel for Tungsten Carbide Coating: Vitrified bond Diamond Grinding Wheels are mainly used for grinding tungsten carbide and non-metal materals. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc. Feature/Benefit of theVitrified Bond Diamond Grinding Wheel for Tungsten Carbide Coating 1. Good free-cutting 2. Good Abrasion Resistance 3. Availability in a broad range of applications in both Dry and Wet Condition Application of the Vitrified Bond Diamond Grinding Wheel for Tungsten Carbide Coating: 1. Surface grinder, 2. Cylindrical grinder 3. Tungsten carbide grinding, 4. Cearmic coating grinding
HVOF Carbide Coating Cylindrical Diamond Grinding wheel Description of the HVOF Carbide Coating Cylindrical Diamond Grinding wheel: HVOF Carbide Coating Cylindrical Diamond Grinding wheel are mainly used for grinding tungsten carbide coating, ceramic coating. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc. Feature/Benefit of the HVOF Carbide Coating Cylindrical Diamond Grinding wheel 1. Good free-cutting 2. Good Abrasion Resistance 3. Availability in a broad range of applications in both Dry and Wet Condition 4. Improved Heat Resistance(Polyimide Series) Application of the HVOF Carbide Coating Cylindrical Diamond Grinding wheel: 1. Cylindrical grinder, 2. Ceramic coating grinding, 3. Tungsten carbide grinding,
ROBTEC 180*6*22.2mm China Factory Direct Sale Abrasive Disc Grinding Wheels For Polishing Stainless Steel And Metal Description for Grinding Wheel for Metal 1. ROBTEC Grinding Wheel for Metal with a thickness of 6.4mm is the right choice for Grinding of sprues, hard welds, build-up welds, cleaning of castings. 2.The design of depressed center allows mutiple angles of usage to the disc (comparing with flat wheels) Features of Grinding Wheel for Metal MPA Verified Grinding Wheel for Metal Maximum Line Speed can be choosed: 70m/s, 80m/s, 100m/s Developed for metal Sharpness Good durability Not easy to burn workpiece High performance abrasive More safety and effciency
Sterling Abrasives Limited (SAL) is an ISO 9001:2008 certified company manufacturing superb quality of grinding wheels made from high quality machinery since 1969. Sterling Abrasives Ltd today enjoys handsome share of the Indian as well as foreign market because we satisfy customers in terms of quality, workmanship, rugged performance of grinding wheels and off course very competitive price. We can manufacture grinding wheel of any shape and size upto 48 Inch diameter. Sterling Abrasives Limited today caters to the need of major Industries like Auto, Auto Components, Bearing, Steel, Spring, Surgical Blades, Compression Spring, Leaf Spring and General Engineering etc. With The In house development, Sterling Abrasives Ltd. has mastered The manufacturing of Rice Rollers and is the largest supplier of Rice Polishing wheels in India. To know more about us and our product range please visit our website : www.sterlingabrasives.com Look forward to receive earliest response from your side. Best Regards, Ankit Jain Sr. Engineer - Marketing and Technical Sterling Abrasives Ltd Delhi Mobile No : +91-9953515233 Email :- ankitjain@sterlingabrasives.com Website : www.sterlingabrasives.com
Polycarbide abrasive wheel with shaft Application for the removal of rust, paint and flaking materials,manufactured by nylon cord with polyurethane coated with emery Dia. 50mm and 75mm;2" and 3" Dia. of shaft: 6mm or 1/4" Thickness: 13-15mm Black ---- Rapid grinding wheel : Removal of general coating and polishing the surface , can be used in stainless steel , mild steel , aluminum, plastics , cement , wood and stone surfaces Blue, purple ---- efficient grinding wheel : more powerful than black products, but not limited to the following purposes . Dark rust removal , polishing surface ablation is serious , clean concrete surface can be used for ships, bridges industry. can be produced according to customer's requirement. Warning:ear, eye, face and body protection
Product Description : keep your knife sharp as new as it should be, it's removable with tremendous suction funtioning that you can attach it wherever you want. Price of product ( USD price or FOB price) : 300pcs 2.64USD.1000pcs . 2.54USD. 3000pcs 2.39USD Product origin : Longjing,Taichung city,Taiwan Key Specifications/Special Features : Green,red Finished Sucution Rubber
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
product model:180*1.6*22mm. materials:aluminium oxide,resin binder. suitable object:metal. price:FOB,but can discuss.
product type:Resin grinding wheel model:125*6*22mm texture:aluminium oxide,Natural resin range of application: metal,building stones
Products Introduce About the size of railway wheel set is mainly determined by the size of the wheel pressure, wheel pressure increased, wheel diameter increased. The material of railway wheel set, for mechanical driving speeds greater than 30m/min, medium and intermediate working types, it is recommended to use cast steel not lower than ZG55, and surface quenching (flame quenching or induction hardening), the hardness is not lower than HB320- 350, quenching depth of not less than 5mm, for human-driven or mechanically driven light-work type, speed less than 30m/min, railway wheel set, surface hardness HB180-240. Products Features 1. Treatment: The heat treatment is quenching or hardening and tempering. 2. Size: Special designs are available, all can customized according to clients' demand. Precise measurement and surface finishes are available. 3. Inspection: All items are checked and tested thoroughly during every working procedure and after the product is finally manufactured to ensure that best quality product goes out in the market.
Product Model:180*3*22. Product Material:aluminium oxide,resin binder. Abrasion object:Metal materials such as steel. This product particle uniform, wear - resistant, wide range of application.If you are interested, please contact
