Inductors, smps, transformers, flyback transformers, common mode chokes, impedence matching transformers and other wound components..
Frequency inverter, motor, servo motor and drive, PLC, soft starter, input and output filter, AC reactor, AC choke, brake unit and resistor.
DC, DC converters, DC, AC inverters, AC, DC converters, transformers, electronic ballasts.
Ethernet network transformer, high frequency transformer,toroidal inductor,smd common mode choke etc.,.
Low frequency ballast, fluorescent lamp, sockets and plugs.
Hid xenon bulb, ballast, fog bulbs.
Varistor & SPD, PTC thermistor, flyback transformer, electronic transformers & coils, energy saving lamps & ballast.
Compact lamps, fluorescent lamps, incandescent lamps, ballast, vacuum flask.
Electronic ballasts, the electronic energy-saving lamps, t5 fluorescent lamps, led lamps, solar lighting.
Outdoor and indoor lighting, basic lighting, commercial lighting, shop lighting, special lighting, home lighting, landscape lighting, flood lighting, road lighting, lighting columns, ballast, lamps, ironware..OEM
Metal halide lamp, sodium lamp, ignitor, floodlight, ballast.
Transformer, current sensor, inductor, choke, open frame power supply, power module, amplifier, crossover, speaker.Contract electronics manufacturing (CEM), PCB, turnkey assembly ( PCBA), electro-mechanical assembly, box build, final products assembly
UVC germicidal lamps, ballasts and water treatment products.
Metal halide ELECTRONIC ballasts, electronic transformers, led drivers, t4, t5, t8, t9, t10, t12, plc electronic ballast, energy saving lamps, UV lamps, gu10 lamp protector, smart switches.
HMI light, ballast, kinoflo, tungsten, tripod, space light, LED.
UV disinfection lamp, ballast, quartz tube.Transportation
Automotive lighting, LED headlight kit, LED headlight bulbs, hid xenon kit, hid xenon ballast.
Product: Solder Ball Product composition: tin 99.3 copper 0.7 Product size: 13mm 19mm 22mm customizable Product weight: can be customized Solder ball is an indispensable and important material in new packaging. It is a new connection method that meets the requirements of electrical interconnection and mechanical interconnection. Due to the rapid development of BGA and CSP in recent years, it has replaced the traditional pin package and lead frame package, thus playing an important role in electrical interconnection and mechanical support in solder balls. BGA, CSP and other packaged devices connected by solder balls are widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. This provides a broad application market and development prospects for solder ball products.
PLC, HMI, servo motor & drive system, frequency inverter (AC drives), soft starters, electrical AC motor, induction motor, brake units, EMI filter, AC choke, brake resistor, breakers.
Hid, ballast, lamp.
