Rotary Dip Switch

1. Slide type (DS series): 2pos, 3pos, 4pos, 5pos, 6pos, 7pos, 8pos, 9pos, 10pos, 12pos. 2. Piano type(DP series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,10pos,12pos. 3. Right angle type(DS series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,9pos,10pos,12pos. 4. IC type(DP series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,10pos,12pos. 5. SMT type(SMD series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,10pos,12pos. 6. Rotary type: hexadecimal,decimal,BCD. Packing All DIP switches are packed in standard IC tube. SMT type can be packed in Tape or Reel packing.

Supplier: Dip switches, dip rotary switches, slide switches, key board switches
Buyer: Connectors

Piano type switch Specifications of piano type switch 2pos, 3pos, 4pos, 5pos, 6pos, 7pos, 8pos, 10pos, 12pos. Mechanical 1.Operation force: 800g max 2.Stroke: 2.00mm 3.Operation temp: -20degree~70degree 4.Storage temp: -40degree to 85degree Materials 1.Base: engineering plastics, black. 2.Cover: engineering plastics, red or blue. 3.Button: engineering plastics, white. 4.Terminal: alloy copper, gold plating. Electrical 1.Electrical life: 2000 operations cycles per switch. 2.Non-switching rating: 100ma, 50vdc 3.Switching rating: 25ma, 24vdc 4.Contact resistance: 50mª+ max, at initial;100mª+ max, after life test. 5.Insulation resistance: 100mª+, 500vdc 6.Dielectric serength: 500vcd/1 minute 7.Capacitance: 5pf max. 8.Circuit: single pole single throw. Soldering and cleaning processes 1.Keep all switch contacts in their "off" position for all operation . 2.Wave soldering: recommended solder temperature at 260degree max.5 seconds for ic type. 3.Hand soldering: use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds, while applying solder. 4.Reflow soldering: reflow zone 240degree for 20 seconds.(for smt type, see the picture) 5.Cleaning process: flux clean using force rinse, high agitation or triple bath cleaning mathod. Freon tf or te give excellent results.When vapor methods are used do not subject the switch to solvents at temperature above 51degree. Packing All dip switches are packed in standard ic tube.

Slide type switch Specifications of Slide type switch: 2pos,3pos,4pos,5pos,6pos,7pos,8pos,9pos,10pos,12pos. MECHANICAL 1.Operation Force: 800g Max 2.Stroke: 2.00mm 3.Operation temp: -20degree~70degree 4.Storage Temp: -40degree to 85degree MATERIALS 1.BASE: Engineering plastics,Black. 2.COVER: Engineering plastics,Red or blue. 3.BUTTON: Engineering plastics,White. 4.TERMINAL: Alloy copper,Gold plating. ELECTRICAL 1.Electrical Life: 2000 operations cycles per switch. 2.Non-Switching Rating: 100mA,50VDC 3.Switching Rating: 25mA,24VDC 4.Contact Resistance: 50mª+ Max,at initial;100mª+ Max,after life test. 5.Insulation Resistance: 100mª+,500VDC 6.Dielectric Serength: 500VCD/1 minute 7.Capacitance: 5pF Max. 8.Circuit: Single pole single throw. SOLDERING AND CLEANING PROCESSES 1.Keep all switch contacts in their "OFF" position for all operation . 2.Wave Soldering: Recommended Solder Temperature at 260degree Max.5 seconds for IC type. 3.Hand Soldering: Use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds,while applying solder. 4.Reflow Soldering: Reflow zone 240degree for 20 seconds.(for SMT type,see the picture) 5.Cleaning Process: Flux clean using force rinse,high agitation or triple bath cleaning mathod. Freon TF or TE give excellent results.When vapor methods are used do not subject the switch to solvents at temperature above 51degree. PACKING Our company manufacturer has developed itself of the designing, production and development of cabling products on logical network. All DIP switches are packed in standard IC tube.

Right-angle type switch Specifications of Right angle type(DS series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,9pos,10pos,12pos. Mechanical 1.Operation Force: 800g Max 2.Stroke: 2.00mm 3.Operation temp: -20degree~70degree 4.Storage Temp: -40degree to 85degree Materials 1.BASE: Engineering plastics,Black. 2.COVER: Engineering plastics,Red or blue. 3.BUTTON: Engineering plastics,White. 4.TERMINAL: Alloy copper,Gold plating. ELECTRICAL 1.Electrical Life: 2000 operations cycles per switch. 2.Non-Switching Rating: 100mA,50VDC 3.Switching Rating: 25mA,24VDC 4.Contact Resistance: 50mª+ Max,at initial;100mª+ Max,after life test. 5.Insulation Resistance: 100mª+,500VDC 6.Dielectric Serength: 500VCD/1 minute 7.Capacitance: 5pF Max. 8.Circuit: Single pole single throw. SOLDERING AND CLEANING PROCESSES 1.Keep all switch contacts in their "OFF" position for all operation . 2.Wave Soldering: Recommended Solder Temperature at 260degree Max.5 seconds for IC type. 3.Hand Soldering: Use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds,while applying solder. 4.Reflow Soldering: Reflow zone 240degree for 20 seconds.(for SMT type,see the picture) 5.Cleaning Process: Flux clean using force rinse,high agitation or triple bath cleaning mathod. Freon TF or TE give excellent results.When vapor methods are used do not subject the switch All DIP switches are packed in standard IC tube.

Cat5e patch panel

AC250V 16A T150 1E4. Size: 30cmx35cmx35cm Quantity: 300 only Weight: 20KG.

AC250V 16A T150 1E4. Size: 30cmx35cmx35cm Quantity: 300 only Weight: 20KG.

Supplier: Dip switch, smd/smt switch, dip rotary switch, cat5e patch panel, 110 wiring block, punch down tool, crimping tool, faceplate, connectors