1. Slide type (DS series): 2pos, 3pos, 4pos, 5pos, 6pos, 7pos, 8pos, 9pos, 10pos, 12pos.
2. Piano type(DP series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,10pos,12pos.
3. Right angle type(DS series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,9pos,10pos,12pos.
4. IC type(DP series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,10pos,12pos.
5. SMT type(SMD series): 2pos,3pos,4pos,5pos,6pos,7pos,8pos,10pos,12pos.
6. Rotary type: hexadecimal,decimal,BCD.
Packing
All DIP switches are packed in standard IC tube.
SMT type can be packed in Tape or Reel packing.
Rotary DIP Switch
Specifications of Rotary type: 10pos, 16pos ,hexadecimal, decimal, BCD.
ELECTRICAL SPECIFICATIONS
Operating voltage: 24VDC Max.
Contact load,static: 400mA Max.
Contact load,dynamic: 150mA Max.
Initial contact resistance: 80mª+ Max.
Insulation resistance: 100mª+ Min.
Solder recommendations
Hand Soldering:340 degree Max. for 2 seconds Max.
Wave Soldering:260degree. Max. for 10 seconds Max.
PACKING
Switches are packed in standard IC Tube Package,47 pcs per tube,and the accessories are bags.
MECHANICAL DATA
Expected life: 10,000 steps
Position per rotation: 10, 16
Operating temperature: -20degree to 70degree
MATERIALS
BASE: Engineering plastics,Black.
COVER: Engineering plastics,Black.
Actuator: Engineering plastics
Contacts: Alloy copper,Gold over nickel plated
TERMINAL: Alloy copper,Tin plated
Our company manufacturer has developed itself of the designing, production and development of cabling products on logical network.
Slide type switch
Specifications of Slide type switch:
2pos,3pos,4pos,5pos,6pos,7pos,8pos,9pos,10pos,12pos.
MECHANICAL
1.Operation Force: 800g Max
2.Stroke: 2.00mm
3.Operation temp: -20degree~70degree
4.Storage Temp: -40degree to 85degree
MATERIALS
1.BASE: Engineering plastics,Black.
2.COVER: Engineering plastics,Red or blue.
3.BUTTON: Engineering plastics,White.
4.TERMINAL: Alloy copper,Gold plating.
ELECTRICAL
1.Electrical Life: 2000 operations cycles per switch.
2.Non-Switching Rating: 100mA,50VDC
3.Switching Rating: 25mA,24VDC
4.Contact Resistance: 50mª+ Max,at initial;100mª+ Max,after life test.
5.Insulation Resistance: 100mª+,500VDC
6.Dielectric Serength: 500VCD/1 minute
7.Capacitance: 5pF Max.
8.Circuit: Single pole single throw.
SOLDERING AND CLEANING PROCESSES
1.Keep all switch contacts in their "OFF" position for all operation .
2.Wave Soldering: Recommended Solder Temperature at 260degree Max.5 seconds for IC type.
3.Hand Soldering: Use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds,while applying solder.
4.Reflow Soldering: Reflow zone 240degree for 20 seconds.(for SMT type,see the picture)
5.Cleaning Process: Flux clean using force rinse,high agitation or triple bath cleaning mathod.
Freon TF or TE give excellent results.When vapor methods are used do not subject the switch to solvents at temperature above 51degree.
PACKING
Our company manufacturer has developed itself of the designing, production and development of cabling products on logical network.
All DIP switches are packed in standard IC tube.
Right-angle type switch
Specifications of Right angle type(DS series):
2pos,3pos,4pos,5pos,6pos,7pos,8pos,9pos,10pos,12pos.
Mechanical
1.Operation Force: 800g Max
2.Stroke: 2.00mm
3.Operation temp: -20degree~70degree
4.Storage Temp: -40degree to 85degree
Materials
1.BASE: Engineering plastics,Black.
2.COVER: Engineering plastics,Red or blue.
3.BUTTON: Engineering plastics,White.
4.TERMINAL: Alloy copper,Gold plating.
ELECTRICAL
1.Electrical Life: 2000 operations cycles per switch.
2.Non-Switching Rating: 100mA,50VDC
3.Switching Rating: 25mA,24VDC
4.Contact Resistance: 50mª+ Max,at initial;100mª+ Max,after life test.
5.Insulation Resistance: 100mª+,500VDC
6.Dielectric Serength: 500VCD/1 minute
7.Capacitance: 5pF Max.
8.Circuit: Single pole single throw.
SOLDERING AND CLEANING PROCESSES
1.Keep all switch contacts in their "OFF" position for all operation .
2.Wave Soldering: Recommended Solder Temperature at 260degree Max.5 seconds for IC type.
3.Hand Soldering: Use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds,while applying solder.
4.Reflow Soldering: Reflow zone 240degree for 20 seconds.(for SMT type,see the picture)
5.Cleaning Process: Flux clean using force rinse,high agitation or triple bath cleaning mathod.
Freon TF or TE give excellent results.When vapor methods are used do not subject the switch
All DIP switches are packed in standard IC tube.
Piano type switch
Specifications of piano type switch
2pos, 3pos, 4pos, 5pos, 6pos, 7pos, 8pos, 10pos, 12pos.
Mechanical
1.Operation force: 800g max
2.Stroke: 2.00mm
3.Operation temp: -20degree~70degree
4.Storage temp: -40degree to 85degree
Materials
1.Base: engineering plastics, black.
2.Cover: engineering plastics, red or blue.
3.Button: engineering plastics, white.
4.Terminal: alloy copper, gold plating.
Electrical
1.Electrical life: 2000 operations cycles per switch.
2.Non-switching rating: 100ma, 50vdc
3.Switching rating: 25ma, 24vdc
4.Contact resistance: 50mª+ max, at initial;100mª+ max, after life test.
5.Insulation resistance: 100mª+, 500vdc
6.Dielectric serength: 500vcd/1 minute
7.Capacitance: 5pf max.
8.Circuit: single pole single throw.
Soldering and cleaning processes
1.Keep all switch contacts in their "off" position for all operation .
2.Wave soldering: recommended solder temperature at 260degree max.5 seconds for ic type.
3.Hand soldering: use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds, while applying solder.
4.Reflow soldering: reflow zone 240degree for 20 seconds.(for smt type, see the picture)
5.Cleaning process: flux clean using force rinse, high agitation or triple bath cleaning mathod.
Freon tf or te give excellent results.When vapor methods are used do not subject the switch to solvents at temperature above 51degree.
Packing
All dip switches are packed in standard ic tube.
