The description of our product
1.Number of Layer: 2 to 20 layers.
2.Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg.
3.The color of soldermask and silkscreen, green, white, black, blue, yellow etc.
4.Surface finish: lead free hal, hal, flash gold, immersion gold, immersion tin, immersion silver, osp, gold finger plating, carbon ink printing, peelable blue mask.
5.The use of product:our products are used in a variety of electronic applications, including hand-phone motherboard,LCD of mobile,computer display card,blind&buried board,wireless router,medical equipment, MP4 players, DVD players ,GPRS,etc.
Material: FR-4
Layer Coverage: 2Layers
Thickness: 1.6mm
Surface Technique: Gold Plating
Line Width/Space: 8mil/8mil
Solder Mask Color: Red
Special: Gold Finger--Chamferring
1 Number of Layer: 2 to 20 layers.
2 Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg.
3 The color of soldermask and silkscreen: Green, White, Black, Blue, yellow etc.
4 Surface Finish: Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask.
5 The use of product: Our products are used in a variety of electronic applications, including hand-phone motherboard, LCD of mobile, computer display card, blind&buried board, wireless router, medical equipment, MP4 players, DVD players, GPRS, etc.
Production cycle:
Sample:
Double sided printed board: 2-4 days four layers printed board: 5-6 days
Six to eight layers printed board: 6-7 days
Product:
Double sided printed board: 6-8 days
Four to eight layers printed board: 8-12 days
Material: FR4
Layer: 1
Thickness: 0.8mm
Surface treating: HAL lead free
Solder mask: BLUE
Min. Line/Space: 0.2mm
Min. Hole: 0.3mm
Lead Time: Only 2 days
S. <5 m2, 7 days
S. >5 m2, 10 days
Profiling: Routing
Copper: 1oz
Electronical Test
