Halogen free pcb
Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
Pth hole diameter tolerance: +/-0.076mm (+/-3mil)
Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers
Vacuum packing in carton
High tg pcb
Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
Pth hole diameter tolerance: +/-0.076mm (+/-3mil)
Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers
Tg 170, packing :vacuum packing in carton
Aluminum pcb
Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
Pth hole diameter tolerance: +/-0.076mm (+/-3mil)
Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers
Vacuum packing in carton
Complete products contract PCB assembly and manufacturing services
- Strong sourcing ability in relative parts and components
- Active and passive components source is directly from original manufacturer
- High-precision 0201 size components SMT technology and lead-free
- RoHS compliant SMT and wave solder process
- Experienced technical staffs in charge of product design
- Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
- IC pre-program
- Full experienced QC and inspector
- Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
- High-precision E-Testing include: ICT, BGA repair device, function test
carton
Base material: FR4, FR1, FR2, CEM-1, CEM-3
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers.
vacuum packing in carton
