Base material: FR4, FR1, FR2, CEM-1, CEM-3
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers.
vacuum packing in carton
4 layer board, blud soldermask, immersion gold surface finishing. Depend on customer requirements.
2 layers rigid-flex pcb Minimum line width/space: 8mils Surface finish: immersion gold Board thickness: 0.50mm Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.10mm flexible pcb inside Carton
Konrich can produce many types of pcb boards - normal single, double to multilayer boards, HDI as well Flex & Rigid-flex boards. Our pcb boards are widely used in many fileds - Industrical control, Communication, Medical, Security, Consumer Electronics, etc.
green solder mask PCB, OSP printed circuit board 1) Thickness: 0.1mm-5mm 2) Minimum linewidth 0.075mm/3mil 3) Minimum gap 0.065/2.8mil 4) Minimum aperture inradium 0.15mm 5) Minimum aperture external diameter 0.45mm 6) Minimum BGA: 0.2mm 7) Layer 4 layers through hole non-impedance All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: Rigid boards up to 42 layers Flex and Rigid-Flex boards up to 40 layers Hybrid solutions for Microwave/RF applications Thermal and signal integrity management solutions, employing coins and cavities 2D or 3D heat-sinks: Copper and Aluminum Carbon printing HDI blind, buried, staggered & stacked vias Buried passive components: capacitors and resistors In-house HATS lab
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: Rigid boards up to 42 layers Flex and Rigid-Flex boards up to 40 layers Hybrid solutions for Microwave/RF applications Thermal and signal integrity management solutions, employing coins and cavities 2D or 3D heat-sinks: Copper and Aluminum Carbon printing HDI blind, buried, staggered & stacked vias Buried passive components: capacitors and resistors In-house HATS lab
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: · Rigid boards up to 42 layers · Flex and Rigid-Flex boards up to 40 layers · Hybrid solutions for Microwave/RF applications · Thermal and signal integrity management solutions, employing coins and cavities · 2D or 3D heat-sinks: Copper and Aluminum · Carbon printing · HDI blind, buried, staggered & stacked vias · Buried passive components: capacitors and resistors · In-house HATS lab