ase Material
Fr4 TG140
Board Thickness
1.6 mm
Copper Thickness
1OZ
Min. Hole Size
8mil (0.2mm)
Min. Line Width/ Spacing
6mil (0.154mm)/5mil (0.125mm)
Solder mask Color
Green
Silkscreen Color
White
Surface Finishing
ENIG
Min.Quantity of Order
No MOQ
Certificate
UL, ISO 9001, ISO 14001
Difficulty
Quick Details: 2W/m.k, Aluminum Core, 1L+Al+1L
Base Material
Aluminum Core
Thermal conductivity
2W/m.k
Layer Counts
1L+Al+1L
Board Thickness
2.0 mm
Copper Thickness
1OZ
Min. Hole Size
12mil (0.3mm)
Min. Line Width/ Spacing
4mil (0.1mm)/5mil (0.125mm)
Solder mask Color
White
Silkscreen Color
Black
Surface Finishing
Lead Free HASL
Min.Quantity of Order
No MOQ
Certificate
UL, ISO 9001, ISO 14001
Difficulty
Aluminum Core
Board Thickness
0.07-0.40mm
Base Material
0.5mil - 2mil Polyimide
Copper Thickness
0.5OZ-2OZ
Stiffener
PI: 0.10-0.25UM, Fr4: 0.1-1.20MM, PET: 0.10-0.18MM, Metal:0.10-0.30MM
Min. Line Width/ Spacing
3mil (0.08mm)/3mil (0.08mm)
Coverlay
Yellow, White, Black
Silkscreen Color
White, Black
Surface Finishing
ENIG, Flash Gold, Immersion Tin, OSP
Min.Quantity of Order
No MOQ
Layer Count
1-6 Layer
pcba
Application Power supply equipment
CHIP Size 0402
QFN Spacing 0.4mm
QFN Spacing 0.4mm
electronic componet SMT
Package Type Tape package, Tay tray package, Pipe package
