pcba
Application Power supply equipment
CHIP Size 0402
QFN Spacing 0.4mm
QFN Spacing 0.4mm
electronic componet SMT
Package Type Tape package, Tay tray package, Pipe package
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Hankook Smart Flex AH35 FEATURES AND BENEFITS All weather traction Enhanced controllability Fuel efficient drive Excellent durability The Hankook Smart Flex AH35 is a highway terrain all-season tire manufactured for commercial vehicles. The tyre model is made to be mounted on the vehicle's steering axle. Hankook Smart Flex AH35 - Key Features All-Weather Performance: The tire offers reliable traction in dry, wet, and winter conditions, thanks to its wide grooves and 3D sipes, which also prevent hydroplaning. Enhanced Control: The ribbed tread design ensures constant road contact, improving steering response and driving stability. Fuel Efficiency: The optimized 3D siping reduces rolling resistance, leading to lower fuel consumption and CO2 emissions. Durability: Reinforced carcass structure maintains the tire's shape under heavy loads, extending tread life and making it cost-efficient.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
Shenzhen Grande Electronic Co., LTD. provides customers with 20 years of leadership and experience in advanced PCB Assembly technology, with proven processes and a full range of services. From prototyping, low volume high mix to high volume global manufacturing, we provide Printed Circuit Board Assembly services in over 40 facilities located in Europe, Asia and the Americas. Grande is a recognized leader, developing the latest PCBA and surface mount (SMT) capabilities including support for : 1, 0201 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit connectors 2, Hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering, double and single sided reflow, wide body and backplanes 3, Quick turn prototype assembly, RoHS compliance certification, conformal & parylene coating, laser marking 4, Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray equipment 5, Comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT), functional test and burn in test (BIT)
Shenzhen Grande Electronic Co., LTD. provides customers with 20 years of leadership and experience in advanced PCB Assembly technology, with proven processes and a full range of services. From prototyping, low volume high mix to high volume global manufacturing, we provide Printed Circuit Board Assembly services in over 40 facilities located in Europe, Asia and the Americas. Grande is a recognized leader, developing the latest PCBA and surface mount (SMT) capabilities including support for : 1, 0201 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit connectors 2, Hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering, double and single sided reflow, wide body and backplanes 3, Quick turn prototype assembly, RoHS compliance certification, conformal & parylene coating, laser marking 4, Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray equipment 5, Comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT), functional test and burn in test (BIT)
Power Supply PCB Product use: Power Supply Layers: 2L Material: SY Thickness: 0.25mm Copper: 20Z Surface: ENIG -
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