Number of layer: 1-40L(Rigid Flex 1-26L)
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer
Min panel size: 10*10mm
Hole center position tolerance: ±0.05mm
Number of layer: 1-56L
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer
Min panel size: 10*10mm
Hole center position tolerance: ±0.05mm
