Number of layer: 1-56L Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc. Copper weight: 0.5OZ-6OZ(18mil-210mil) Board thickness: 0.2-7.2mm(8mil-282mil) Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc. Silk screen: White, blue, black, etc. Solder mask: Green, black, red, blue, yellow, white, etc. Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc. Test: Fly Probe test, fixture test Performance test: 100% electricity performance test Min hole size: 0.2mm, Laser 0.1mm Min line width/Space: 3mil/2mil Outline profile: Rout, V-cut, Bridge, Stamp hole Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer Min panel size: 10*10mm Hole center position tolerance: ±0.05mm