Layer: 1~22 layers
Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg
Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating
Max.Panel Size: 550 * 650mm
Min. Finished Holes Size: 0.10mm
Microvias diameter: 0.10 - 0.15mm
Min. Line Width/Spacing: 0.075 / 0.075mm
Copper Feature to Holes(Outer): ±0.075mm
Min. Plated Drills to Copper(inner): 0.25mm
Min. Copper to Edge distance: 0.25mm
Max. Copper Thickness: 140m
Max. Board Thickness: 4.80 mm
Min. Board Thickness: 0.20mm
Min. Core Thickness: 0.10mm
Min. Soldermask Dam: 0.10mm
Layer:1~22 layers
Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg
Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating
Max.Panel Size: 550 * 650mm
Min. Finished Holes Size: 0.10mm
Microvias diameter: 0.10 - 0.15mm
Min. Line Width/Spacing: 0.075 / 0.075mm
Copper Feature to Holes(Outer): ±0.075mm
Min. Plated Drills to Copper (inner): 0.25mm
Min. Copper to Edge distance: 0.25mm
Max. Copper Thickness: 140μm
Max. Board Thickness: 4.80 mm
Min Board Thickness: 0.20mm
Min. Core Thickness: 0.10mm
Min. Soldermask Dam: 0.10mm
