Layer: 1~22 layers Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating Max.Panel Size: 550 * 650mm Min. Finished Holes Size: 0.10mm Microvias diameter: 0.10 - 0.15mm Min. Line Width/Spacing: 0.075 / 0.075mm Copper Feature to Holes(Outer): ±0.075mm Min. Plated Drills to Copper(inner): 0.25mm Min. Copper to Edge distance: 0.25mm Max. Copper Thickness: 140m Max. Board Thickness: 4.80 mm Min. Board Thickness: 0.20mm Min. Core Thickness: 0.10mm Min. Soldermask Dam: 0.10mm