Copper Thickness:
0.5-10oz
Board Thickness:
0.1-8mm
Min. Hole Size:
Drill hole size 0.1mm; Punch hole 0.4mm
Min. Line Width:
3mil
Min. Line Spacing:
3mil
Surface Finishing:
HAL ,Imm Ni/Au/Ag ,OSP with gold finger etc
Product name:
Multilayers rigid boards with gold fingers
Material:
FR1/ FR2/ FR3/ CEM1/ CEM3/ ROGERS/ ARLON/ ISOLA.
Number of layers:
1-40 layers
Board Type:
Rigid
Surface treatment:
HAL ,Imm Ni/Au/Ag ,OSP with gold finger etc
Solder mask color:
As clients required
Silkscreen color:
As clients required
Max board size:
700*1200mm
Application:
Electronics Device
Certificates:
ISO/UL/TS16949/RoHS/TS16949
