Copper Thickness: 0.5-10oz Board Thickness: 0.1-8mm Min. Hole Size: Drill hole size 0.1mm; Punch hole 0.4mm Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: HAL ,Imm Ni/Au/Ag ,OSP with gold finger etc Product name: Multilayers rigid boards with gold fingers Material: FR1/ FR2/ FR3/ CEM1/ CEM3/ ROGERS/ ARLON/ ISOLA. Number of layers: 1-40 layers Board Type: Rigid Surface treatment: HAL ,Imm Ni/Au/Ag ,OSP with gold finger etc Solder mask color: As clients required Silkscreen color: As clients required Max board size: 700*1200mm Application: Electronics Device Certificates: ISO/UL/TS16949/RoHS/TS16949
