Specification: 6L
Material: FR-4 TG170
Board thickness: 1.6mm
Final copper: 35um
Solder mask color: Blue
Surface Finish: Immersion Gold, Au: min. Impedance control
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection.
Layer: 10L
Base Material:FR-4 tg180(ITEQ)
Board Thickness: 1.6mm
Final copper: 35um
Surface Finish:Immersion Gold/Au: min. Gold fingers/Au:30u
Solder mask: Green
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection.
Layer: 2 layer
Materials: PI
Copper Thickness: 35um
Min Board Thickness: 0.1mm
Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver
PI thickness: 1/2mil, 1 to 10 mil
ADH thickness: 1/2mil, 1mil
FPC, flexible PCB OEM/ODM.
Layers count: 4,
Flex layers count: 2,
Surface treatment: Immersion gold,
Minimum hole size: 0.35mm,
Minimum line width/space: 8/5.9 miles,
Thickness: Rigid board: 2.00mm, Flex board: 0.24mm
Size: 397.89 x 555mm.
Layer: 2L
Base Material:CEM-3 CTI300
Board Thickness: 1.6mm
Final copper: 35um
Surface Finish: Immersion Tin/Sn
Solder mask: Green
Silkscreen: white
Profile: Routing + v-cut
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection.
