Excellence Electronic Co., Ltd

What is High Frequency (HF) PCB Electronic devices with high frequency is the developing tendency nowadays, especially in wireless network. Satellite communication growing rapidly, information products move towards high speed and high frequency. Thus developing new products always need to use high frequency substrate, satellite system, mobile telephone receiving base station and so on, these communication products must use high frequency PCB. The features of Thick Copper PCB. DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay. DF should be small, which mainly affect quality of signal transmission, the smaller DF could make smaller signal wastage accordingly. The thermal expansivity should be the same with copper foil as much as possible, because the difference will lead to copper foil separated in the changes of cold and heat. Water absorptivity must be low, high water absorptivity will affect DK and DF when in the wet environment.

2-28 layers multilayer pcb board Fr4,rogers,taconic,isola,material raw high frequency high quality pcb manufacturer inner:bubble bag outer: carton box

Adopt f4bme high frequency material, osp, hasl, lf-hasl, enig, etc. Used in satellite, antenna, radar, etc.

High frequency flexible pcb board for automobiles, surface finishing with immersion gold, apply for industrial control, 0.2 mm min hole size pcb, flex-rigid pcb circuit board 1.Pcb p/n:2597876 2.Material: fr-4 3.Layer: 4l 4.Board thk:1.0mm+0.2mm 5.Copper thk:35um 6.Smallest hole size:0.2mm 7.No. Of holes (pcs):39 8.Line w/s:5/5mil 9.Impedance control. Y / n (tol %):n 10.Surface enig 11.Solder mask silkscreen:green 12.Single board size:dim x (mm):236;dim y (mm):85 13.Special: high frequency flexible pcb board for automobiles 14.Routing/punching:cn O-leading supply chain (hk) co., limited, we strives to be your one stop solution partner of ems from china, including pcb design , pcb fabrication and pcb assembly (pcba), electronic components and so on.

More than 85+ Types Rogers/Arlon/Taconic/Isola/ Nelco/F4B Serices,etc Materials can be Specified Impedance Tolerance �±5%(min) Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM's in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.

Layers3 36 Layers HDI Step 3+N+3 Min.Line Width0.05mm (2 mil) Min.Line Space0.05mm (2 mil) Min.Annular ring0.1mm (4 mil) Min. Via0.1mm (4 mil) Max.Size500mm X 800mm MaterialFR4,High Tg220 Material thickness Start at 25um Plus copper Copper thickness0.3 OZ to 10 OZ (10um 350um) Please contact us for more information about HDI PCB Board.

What is HDI PCB High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices. Advantages of HDI PCB The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.