High Frequency Flexible Pcb

We have over 10years experiences in fpc manufacturing, 1 layer to 6 layer fpc manufacturing and smt assembly, including components sourcing with competitive cost. FPC Process Capability processing layers: 1-6 layers Finished thickness: 3mil (0.08mm) Minimum aperture: 4mil (0.10mm) Min.line width / spacing: 2 mil (0.05mm) Maximum board size: 10 "x 45" (250x 1200mm) Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold Insulation resistance: ± 1011(Normal Normal) Thermal shock resistance: 260 10 sec. Processing materials: Polyimide (PI), polyester (PET), polyimide (PI) + FR4

Our Product Range 4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board, halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board, 1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products. PCB Process Capability processing layers: 1- 30 layers Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm) Minimum aperture: 6mil (0.15mm) Minimum line width / spacing: 3-4 mil (0.076-0.10mm) Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm) Impedance Control: ± 10% Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin. Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)

FPC Process Capability processing layers: 1-6 layers Finished thickness: 3mil (0.08mm) Minimum aperture: 4mil (0.10mm) Min.line width / spacing: 2 mil (0.05mm) Maximum board size: 10 "x 45" (250x 1200mm) Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold Insulation resistance: ± 1011 (Normal Normal) Thermal shock resistance: 260 10 sec. Processing materials: Polyimide (PI), polyester (PET), polyimide (PI) + FR4

Our service & advantage as below: 1.PCBA turnkey assembly service. 1)we have extensive and stable components sourcing,it can help you to save procurement costs and time. 2)Burning IC program,you can be sure with that we have a strict confidentiality system for clients'design files. 3)PCBA functional test to saving your labor costs and test time. 2.PCBA engineering service. our engineers can help you to figure out if you have any design problems in PCB&PCBA project. 3.Offer 12 months warranty on our assembly jobs. 4.PCBA fast prototype in one week. 5.PCB(1~16 Layer) and FPC(1~4 Layer) bare boards fast production. 6.NO MOQ.

Okeir is a professional pcb manufacturer in Shenzhen,China, main business is PCB, fpc, rigid flexible pcb, turnkey pcba assembly service, We are committed to continuous improvement and customer satisfaction by providing exceptional service and technical support in the production and timely delivery of quality products, which include PCB assemblies, cable assemblies and full box assemblies and electronic/electrical components.welcome your inquiry by

Supplier: High-density multilayer PCBs, Aluminum PCBs, Multilayer PCBs, Double-sided PCBs, Lead free HAL PCBs, High frequency PCBs, Flexible PCBs, Single-sided PCBs, Quick-turnaround PCBs, Ultrathin PCBs

What is High Frequency (HF) PCB Electronic devices with high frequency is the developing tendency nowadays, especially in wireless network. Satellite communication growing rapidly, information products move towards high speed and high frequency. Thus developing new products always need to use high frequency substrate, satellite system, mobile telephone receiving base station and so on, these communication products must use high frequency PCB. The features of Thick Copper PCB. DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay. DF should be small, which mainly affect quality of signal transmission, the smaller DF could make smaller signal wastage accordingly. The thermal expansivity should be the same with copper foil as much as possible, because the difference will lead to copper foil separated in the changes of cold and heat. Water absorptivity must be low, high water absorptivity will affect DK and DF when in the wet environment.

2-28 layers multilayer pcb board Fr4,rogers,taconic,isola,material raw high frequency high quality pcb manufacturer inner:bubble bag outer: carton box

Adopt f4bme high frequency material, osp, hasl, lf-hasl, enig, etc. Used in satellite, antenna, radar, etc.