Mijing CH5-D intelligent mainboard layered welding platform, 3 in 1 universal Phone 12/12P PCB heating platform, support A14 CPU chip, A14 HHD, Phone 12/12P Baseband, Phone 12/12P baseband and glue removal Product Features : Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183�° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard. Product Specification : Item name: Mijing CH5-D Welding Platform Brand: MiJing Model: CH5-D Color: Blue Weight: 1.65KG Voltage: 100-250V
Mijing CH5 Intelligent Motherboard Layered Desoldering Platform for Phone X-12 pro max PCB Teardown, MJ CH5 phone Motherboard Preheating Separating Desoldering Tools for Phone X Xs Xs Max 11 11 pro 11 pro max 12 12 pro 12 pro max 12 mini. MJ CH5 Pre-Heating groove for phone X XS XS-MAX MJ CH5-BC Pre-Heating groove for phone 11 11 pro 11 pro max MJ CH5-E Pre-Heating groove for phone 12/12 pro/12 pro max/12 mini Features : Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183 three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Whole milk USDA organic High vitamin D 50mg of DHA Omega-3 per serving Contains choline and calcium Source of prebiotics Description To create Horizon Growing Years organic milk, we partnered with pediatricians to identify key nutrients for growing kids, ages 1 to 5. Every delicious glass provides 50mg of DHA Omega-3 to help support brain health, a good source of choline to transport DHA in the body, as well as prebiotics that help feed good bacteria in the gut and high vitamin D and calcium for strong bones. Growing years helps deliver the nutrition kids need, in the great-tasting organic whole milk they love. Also, this certified USDA organic milk comes from happy cows raised by our trusted farmer partners, and it's non-GMO, meaning it comes from cows that are pasture-raised* without antibiotics, toxic, persistent pesticides, or added hormones**. Stylish and Sturdy Solution for Displaying Your Plants Enhance the beauty of your garden or indoor space with our Premium Quality Rectangular Mild Steel Plant Stand. Designed for durability and style, this plant stand provides a stable and elegant platform for displaying your favorite plants. Key Features: Durable Construction: Made from high-quality mild steel, this plant stand is strong, sturdy, and built to last, providing reliable support for your plants. Elegant Design: The sleek, rectangular design adds a touch of sophistication to any space, making it perfect for both indoor and outdoor use. Weather-Resistant: Coated with a weather-resistant finish, this plant stand can withstand various weather conditions, ensuring long-lasting use without rust or corrosion. Stable Platform: The sturdy base and well-balanced design ensure that your plants remain stable and secure, preventing tipping or wobbling. Versatile Use: Ideal for displaying a variety of plants, including potted flowers, herbs, succulents, and small shrubs. Perfect for use on patios, balconies, living rooms, or gardens. Product Specifications: Material: Mild Steel Color: Black Dimensions: 62 cm (length) x 22 cm (width) x 12 cm (height) Weight Capacity: Up to 90 kg Finish: Weather-Resistant Powder Coating Grid Pattern: Provides extra support and prevents pots from slipping Rust Resistant: Yes How to Use: Assembly: No assembly required; the plant stand is ready to use out of the box. Placement: Place the plant stand on a flat, stable surface in your desired location, whether indoors or outdoors. Display Plants: Arrange your potted plants on the stand, ensuring they are evenly distributed to maintain balance and stability. Maintenance: Wipe the plant stand regularly with a damp cloth to remove dust and debris. Check periodically for any signs of wear or damage. Care Instructions:
º LGA1155 socket for new 2nd Generation Intel® Core? i7 series processor/Intel® Core? i5 series processor/Intel® Core? i3 series processor/Intel® Pentium® processors/Intel® Celeron® processors CHIPSET º Intel® H67 Express Chipset MEMORY º Dual-channel DDR3 memory architecture º 4 x 240-pin DDR3 DIMM socket support up to 32GB* º Support DDR3 1333/1066 SDRAM º *(Due to the DRAM maximum size is 4GB at present, the memory maximum size we have tested is 16GB) Due to the operating system limitation, the actual memory size may be less than 4GB for the reservation for system usage under Windows® 32-bit OS. For Windows® 64-bit OS with 64-bit CPU, there is no such limitation EXPANSION SLOT º 2 x PCI Express Gen 2.0 x16 slots º 1 x PCI Express x1 slot º 2 x PCI slots º *The second PCIEX16 only support bandwidth x4 STORAGE º Support by Intel® H67 ? 4 x Serial ATA 3.0Gb/s devices ? 2 x Serial ATA 6.0Gb/s devices AUDIO º Realtek ALC892 8-Ch High Definition audio CODEC º Compliant with HD audio specification LAN º Realtek 8111E Gigabit LAN Fast Ethernet Controller REAR PANEL I/O º 1 x PS/2 keyboard/mouse combo port º 1 x RJ45 LAN connector º 1 x Audio port (Line-in, Line-out, Mic-in) º 1 x Clear_CMOS button º 8 x USB 2.0 ports INTERNAL I/O CONNECTORS & HEADERS º 1 x 24-pin ATX Power Supply connector º 1 x 8-pin ATX 12V Power Connector º 1 x 4-pin CPU_FAN connector º 1 x 3-pin PWR_FAN connector º 1 x 3-pin SYS_FAN connector º 1 x Reset button º 1 x Speaker header º 1 x Front panel switch/LED header º 1 x Front panel audio header º 1 x SPDIF out header º 1 x Clear CMOS header º 1 x Serial port header º 1X Power on LED (Green light) º 1X Stand by LED (Red Light) º 4 x SATA 3Gb/s connectors º 2 x SATA 6Gb/s connectors º 3 x USB 2.0 headers support additional 6 USB ports º 1 X EZ charger SYSTEM BIOS º AMI BIOS with 32Mb SPI ROM º Supports Plug and Play, STR (S3) / STD (S4) , Hardware monitor, Multi Boot º Supports ACPI & DMI º Audio, LAN, can be disabled in BIOS º F7 hot key for boot up devices option º Support eJIFFY º Support eBLU º Support eDLU º Support eSF º Support Page Up clear CMOS Hotkey º Supports ACPI revision 3.0 specification º Support ECS M.I.B III Utility CPU voltage adjustable FORM FACTOR º ATX Size, 305mm*210mm.
UK WAREHOUSE, DDP TO UK Specifications: 1. Color: As Picture Show 2. Main Material: Steel and TPR Rubber Wheels 3. Overall Size (Fully Extended): 32.7"H x 28.7"W x 18.5"D 4. Folded Dimension: 8.7"H x 28.7"W x 18.5"D 5. Net Weight: 15.4 lb 6. Weight Capacity: 330 lb Package Includes: 1 x Platform Cart 1 x Instruction
Part / Feature Specification / Support Motherboard description Motherboard manufacturer's name: Pegatron M2N68-LA HP/Compaq name: Narra6-GL6 CPU/Processor Socket: AM3 only HyperTransport 1.0 only 2000 MT/s (2.0 GT/s) or 1600 MT/s (1.6 GT/s), depending on the processor. Memory support is DDR3 modules only. Supports the following processors: AMD Phenom II X4 9xx/9xxe/8xx Quad-Core (D) AMD Phenom II X3 7xx/7xxe Triple-Core (H) AMD Phenom II X2 5xx (C) AMD II Athlon X4 6xx/6xxe (P) AMD II Athlon X3 4xx/4xxe (R) AMD II Athlon X2 2xx/2xxe (R) AMD Sempron 1xx (S) Max TDP = 95 Watt Front-side bus (FSB) HyperTransport 1.0 ONLY, based on the NVIDIA GeForce chipset requirements 2000MT/s (2.0 GT/s) Chipset NVIDIA GeForce 6150SE nForce 430 BIOS features Keyboard combination to used to enter BIOS: F10 System BIOS core brand: Award Form factor 9.6" (24.5 cm) x 9.6" (24.5 cm) Memory Dual channel memory architecture Two DDR3 DIMM (240-pin) sockets Supported DIMM types: PC3-8500 (DDR3-1066) PC3-10600 (DDR3-1333) Non-ECC memory only, unbuffered Supports 2GB DDR2 DIMMs Supports up to 4 GB* on 32 bit PCs NOTE: *32-bit operating systems cannot address a full 4.0 GB of memory. Expansion slots One PCI One PCI Express x16 graphics (for a graphics card) Two PCI Express x1 (for cards such as network, sound, tv-tuner) Video graphics Integrated graphics using nVidia GeForce 6150SE Also supports PCI Express x16 graphics cards* NOTE: *Either integrated graphics or the PCI Express x16 slot are usable at one time; they are not usable concurrently. Serial ATA Four SATA connectors: SATA0 = Blue SATA1 = White SATA2 = Light Blue SATA3 = Yellow Supports 1 SATA-150 or SATA-300 disk drive on each SATA connector Speed up to 1.5Gb/sec or 3.0Gb/sec, complying with SATA 1.0 and SATA 2.0 specifications NOTE: The faster rate of 3.0Gb/sec requires that both the hard drive and the motherboard support it. If one or the other does not support 3.0 Gb/sec, the PC negotiates down to the slower 1.5 Gb/sec. Onboard audio 6 channel high-definition audio Audio CODEC: ALC888S Onboard LAN Realtek RTL8201N 10/100Mbps Onboard USB USB 2.0 Ten ports total Four connectors on back panel Four additional headers on motherboard support 6 additional ports/devices NOTE: Some USB ports may not be available externally for customer use. For more information, see model specifications. Back panel I/0 One VGA port Four USB 2.0 One RJ-45 networking port Stereo-mini audio jacks for: Microphone-in (pink) Line-out (lime) Line-in (light blue) Internal connectors One CPU fan connector One 24-pin ATX power connector One 4-pin ATX power connector One ROM recovery connector Four SATA connectors One ROM recovery connector One jumper for resetting BIOS settings One jumper to clear the BIOS password setting One system panel connector One AC Power Loss Restart Selector Four USB headers, supporting 6 USB connections One S/PDIF out connector One Front audio connector for headphone and microphone One chassis fan connector. Weight:1.5kg.
Gigabyte X570SI AORUS PRO AX Mini-ITX Motherboard Gigabyte Z690 UD LGA1700 ATX Motherboard MSI MPG Z690 EDGE WIFI DDR4 LGA 1700 ATX Motherboard ASUS PRIME Z690M-PLUS D4 LGA 1700 Micro-ATX Motherboard MSI MPG Z690 EDGE WIFI DDR4 LGA 1700 ATX Motherboard Gigabyte Z690 UD LGA1700 ATX Motherboard MSI MPG X570 GAMING EDGE WIFI AM4 ATX Motherboard ASUS TUF Gaming X570-PRO Wi-Fi AM4 ATX Motherboard ASUS PRIME Z690M-PLUS D4 LGA 1700 Micro-ATX Motherboard ASUS PRIME B560M-A LGA 1200 Micro-ATX Motherboard ASUS Republic of Gamers Z690-I GAMING WIFI LGA 1700 Mini-ITX Motherboard ASUS PRIME B660M-A D4 LGA 1700 Micro-ATX Motherboard ASUS PRIME H670-Plus D4 LGA 1700 ATX Motherboard ASUS Prime H510M-A LGA 1200 Micro-ATX Motherboard MSI B560M-A PRO LGA1200 Micro-ATX Motherboard ASUS ROG STRIX B560-A GAMING WIFI LGA 1200 ATX Gaming Motherboard Gigabyte B550 Gaming X V2 AM4 ATX Motherboard ASUS PRIME B550M-A/CSM AM4 Micro-ATX Motherboard MSI PRO B660M-A WIFI DDR4 LGA 1700 Micro-ATX Motherboard ASUS ROG STRIX Z690-F GAMING WIFI LGA1700 ATX Motherboard MSI MAG Z690 TOMAHAWK WIFI DDR4 LGA 1700 ATX Motherboard Gigabyte B550 VISION D-P AM4 ATX Motherboard ASUS TUF Gaming B550M-PLUS Wi-Fi AM4 Micro-ATX Motherboard ASUS PRIME B550M-A WI-FI AM4 Micro-ATX Motherboard MSI MPG B560I GAMING EDGE WIFI LGA 1200 Mini-ITX Motherboard
TYPE Description Mechanical standard 3.5" Industrial Motherboard 148mm x 104mm Processor - Intel Core i7 4500U Processor (4M Cache, 3 GHz, Haswell) With up to 15 W TDP - BIOS AMI BIOS - 64MBit BIOS Memory - One 204-pin DDR3 SDRAM Small Outline (SO-DIMM) socket Support DDR3L 1600 MHz SO-DIMM 1.35V - Support 8GB Max Graphics - Intel HD Graphics 4400 Display: VGA / HD Video Three Display * 2 x HD Video (port), 1 x VGA (header) LAN - 2 x Intel I211-AT 1000M Audio - Realtek ALC662 HD Audio Decoding controller 6 Channel Audio output - Line out + MIC IN Port COM 6 x COM port ( RS485 optional ) USB - 2 x On-board USB 2.0 4 x On-board USB 3.0 2 x Pin interface USB 2.0 1 x SATA 3.0 (6Gb/s) 1 x Mini PCIE port Expansion Port 1 x PCI E xpress Full-Mini Card connector ( for mSATA SSD ) 1 x PCI E xpress Half-Mini Card connector ( for WIFI and Bluetooth ) 1 x SIM port (optional) 1 x SATA power connector 1 x SATA 3.0 connector (6Gb/s) 1 x DDR3 SO-DIMM socket 1 x Front panel header 6 x Serial port headers ( RS485 optional ) 1 x D-sub header 1 x GPIO header 1 x Automatically boot jumper 2 x USB 2.0 header 1 x Audio header Front Panel - 1 x Push button for Power ON/OFF 1 x Power LED 1 x HDD LED 2 x USB 3.0 ports 2 x USB 2.0 ports Back Panel - 1 x DC in connector 2 x HDMI Connectors 2 x RJ45 1000M ports 2 x USB 3.0 Ports 1 x Mic in port 1 x Speaker out port Power Supply - DC 12V Working condition - Operation Temperature -10 -50 C Operation Humidity 10%-90% Relative Humidity, Non-Condensing Accessories Cable for SATA HDD
MIJING C20 Motherboard Layerer test fixture For Phone 12/12 mini/12 Pro/12Pro max. MJ C20 4 IN 1 Phone 12 series logic board function tester for Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper/lower layer tester. MJ C20 test fixture for Phone 12 series motherboard separating testing repair. Function: 1. MJ C20 separating test fixture test platform is used for Phone 12/12mini/12Pro/12Pro max motherboard separating repair. 2. Support motherboard without middle frame test. 3. Accurate alignment : Every test rack has experienced many tests, quality assurance.
2023 MIJING Z20 Pro 18 IN 1 middle layer reballing platform for iPhone X-14 PRO MAX. MJ Z20 Pro iPhone motherboard middle layer frame tin planting platform with stencil steel mesh for iPhone X-14 Pro Max motherboard soldering repair. Option: 1. Mijing Z20 Pro 18 in 1 for iPhone X-14 Pro Max. 2. Mijing Z20 Pro 14 in 1 for iPhone X-13 Pro Max. Product Features: iPhone X-14 PRO MAX BGA reballing fixture tool. Used for positioning and reballing iPhone X-14 Pro Max PCB BGA parts. Convenient and faster for reballing BGA without any damage. Offer you best solution for iPhone X-14 Pro Max BGA reballing and repairing. How to install: Install the iPhone X-14 Pro Max main board on the platform Cover the iPhone X-14 Pro Max BGA reballing stencil on mainboard Evenly spread tin on the cover of the reballing stencil Remove the reballing stencil cover Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
Mijing K35 tin planting platform with BGA reballing stencil for Phone 12 Mini 12 Pro Max logic board soldering repair, MJ K35 metal BGA reballing stencil for Phone 12 12 Mini 12 Pro 12 Pro Max BGA PCB welding repair. Product Features : Install the Phone 12/12 Mini/12 Pro/12 Pro Max main board on the platform Cover the Phone 12/12 Mini/12 Pro/12 Pro Max BGA reballing stencil on mainboard Evenly spread tin on the cover of the reballing stencil Remove the reballing stencil cover Take out the motherboard and cooperate with the hot air gun to solidify the tin point. Product Specification : Item Name: MJ K35 Tin Platform Model: K35 Material: Imported synthetic stone material Color: Blue + Silver Size: 120 115 20mm Weight: 350g Suit For: Phone 12/12 Mini/12 Pro/12 Pro Max Application: For Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper / lower layers logic board soldering repair.
BGA rework station, solder BGA machine for laptop, computer, xbox360, PS3 and mobile motherboard.
Salient Features Special linear weigher control with load cell & stepper motors Operator friendly PLC controller with a user friendly GUI Pouch style options Center seal pouch with increased panel area Advanced Constant Heat sealing System Specially designed film roll unwinding mechanism for smooth bag pulling Operation with brake system. Independent drives for sealing ,Feeding & film feed operations for optimum performance Less floor space requirement for machine installation. Equipped with variable speed drive for flexibility to offer adjustable output for the machine Bag Unwinding by Lanatex belt drive through servo motors and control cards Flexible vertical seal jaw positioning to offer range of variable pack with offering Quick change-over facility Suitable for different range of packaging film i.e PE film with or with out Laminate Special safety card to control current for protection electrical / electronics equipment Adjustable bag length by PLC controlled via servo motors and control cards Linear weighing system for accurate dosing Independent temperature controller for both seal Jaw's security devise to protect the operator of the machine Electric Panel IP-54 Protection Standard Machine Packaging Capabilities Potato Chips, Snacks, Rice, Macaroni, Beans, Pasta, Dry Fruits, Pasta, Vermicelli, Candies & Confectionery products as well as all kinds of lightweight products. Technical Specifications Output Quantity: 50 g 2000 g Output: 20-55 bags/min Filler Accuracy: ± 5 gm Pack / Quantity Range: Min. Bag size (W x L) approx: 120 mm x 150 mm Max. Bag size (W x L) approx: 355 mm x 500 mm Packaging Material: Co-extruded 3 or 5 Layer PE Based or Laminated, Metalize, Aluminum Foil 60 to 140 microns Film Reel: Core dia 76 mm & Reel diameter 300 mm max Electrical Requirement: Input Supply: 380 V AC, 50 Hz, 3 ph + N + G Connected Load: 5.5 KVA Peak Power Rating: 5 KW Air Requirement: Air Pressure: 6 bar constant dry air Air consumption: 800 Ltr/min Machine Dimensions along with conveyor (W x D x H) approx.: 1110 mm x 1700 mm 2400 mm (1300 mm x 1956 mm x 3350 mm) for 5kg Weight: 600 kgs (Net) Optional Accessories Customised pack Size Photo mark Registration Unit for Panel Printed Films Automatic Pouch Counting System Inert Gas Flushing System Product discharge conveyor Date Coding System Extra Pneumatic Magazine Shaft Optional Film End Sensor UV Sterilisation of packaging film Special impulse sealing jaw Bucket elevator â?¢ Platform English Folding System Extra Conformer for different sizes Air release system Linear weigher
Salient Features Special multi head weigher control with load cell & stepper motor Operator friendly PLC controller with a user friendly GUI Pouch style options Center seal pouch with increased panel area Advanced Constant Heat sealing System Specially designed film roll unwinding mechanism for smooth bag pulling Operation with brake system. Independent drives for sealing ,Feeding & film feed operations for optimum performance Less floor space requirement for machine installation. Equipped with variable speed drive for flexibility to offer adjustable output for the machine Bag Unwinding by Lanatex belt drive-through servo motors and control cards Flexible vertical seal jaw positioning to offer range of variable pack with offering quick change-over facility Suitable for different range of packaging film i.e PE film with or with out Laminate Special safety card to control current for protection electrical / electronics equipment Adjustable bag length by PLC controlled via servo motors and control cards Multi head weighing system for accurate dosing. Independent temperature controller for both seal Jaw's security devise to protect the operator of a machine Electric Panel IP-54 Protection Standard. Machine Packaging Capabilities Potato Chips, Rice, Macaroni, Beans, Snacks Pasta, Dry Fruits, Vermicelli, Candies & Confectionery products as well as all kinds of lightweight of products. Technical Specifications Output Quantity: 15 g - 1000 g 30 - 85 Packs/min Filler Accuracy: ± 5 gm to 5 g Pack / Quantity Range: Min. Bag size (W x L) approx: 120 mm x 150 mm Max. Bag size (W x L) approx: 225 mm x 350 mm Packaging Material: Co-extruded 3 or 5 Layer PE Based or Laminated, Metalize, Aluminum Foil 40 to 120 microns Film Reel: Core Diameter 76 mm & Reel Diameter 300 mm max Electrical Requirement: Input Supply: 220 or 380 V AC, 50 Hz, 3 ph + N + G Connected Load: 3.5 KVA Peak Power Rating: 3 KW Air Requirement: Air Pressure: 6 bar constant dry air Air consumption: 800 Ltr/min Machine Dimensions along with conveyor (W x D x H) approx.: 1110 mm x 1700 mm x 2438 mm Weight: 700 kgs (Net) Optional Accessories Customised pack Size Photomark Registration Unit for Panel Printed Films Automatic Pouch Counting System Inert Gas Flushing System Product discharge conveyor Date Coding System Extra Pneumatic Magazine Shaft Optional Film End Sensor UV sterilisation of packaging film Special impulse sealing jaw Bucket elevator Platform English Folding System Extra Conformer for different sizes Air release system Linear weigher
Salient Features Special volumetric cup dozing system control by special gear motor Operator friendly PLC controller with a user friendly GUI Pouch style options Center seal pouch with increased panel area Advanced Constant Heat sealing System Specially designed film roll unwinding mechanism for smooth bag pulling Operation with brake system. Independent drives for sealing, Feeding & film feed operations for optimum performance Less floor space requirement for machine installation. Equipped with variable speed drive for flexibility to offer adjustable output for the machine Bag Unwinding by Lanatex belt drive through gear and servo motors Flexible vertical seal jaw positioning to offer range of variable pack with offering quick change-over facility Suitable for different range of packaging film i.e PE film with or with out Laminate Special safety card to control current for protection electrical / electronics equipment Adjustable bag length by PLC and servo motor and control cards Independent dozing system Independent temperature controller for both seal Centralized lubrication system Jaw's security devise to protect the operator of machine Film end sensor Electric Panel IP-54 Protection Standard. Machine Packaging Capabilities Rice, Sugar, Beans, Seeds, Salt, Tea, Spices, Pulses as well as all kind of granule products. Technical Specifications Output Quantity: 50 g - 2000 g 20 - 55 Bags/min Filler Accuracy: ± 5 gm Pack / Quantity Range: Min. Bag size (W x L) approx: 120 mm x 150 mm Max. Bag size (W x L) approx: 355 mm x 500 mm Packaging Material: Co-extruded 3 or 5 Layer PE Based or Laminated, Metalize, Aluminum Foil 60 to 140 microns Film Reel: Core Diameter 76 mm & Reel Diameter 300 max Electrical Requirement: Input Supply: 380 V AC, 50 Hz, 3 ph + N + G Connected Load: 5.5 KVA Peak Power Rating: 5 KW Air Requirement: Air Pressure: 6 bar constant dry air Air consumption: 800 Ltr/min Machine Dimensions along with conveyor (W x D x H) approx.: 1110 mm x 1700 mm x 2400 mm (1300 mm x 1956 mm x 3350 mm) for 5 Kg Weight: 600 kgs (Net) Optional Accessories Customised pack Size Photomark Registration Unit for Panel Printed Films Automatic Pouch Counting System Inert Gas Flushing System Product discharge conveyor Date Coding System Extra Magazine Shaft Programmer cam switch controller Impulse jaw Platform English Folding System Bucket Elevator Extra Dosing cup Extra Conformer for different sizes Air release system Special Weighing System
Salient Features Advance augur dozing system control with special servo motor Operator friendly PLC controller Independent augur system with adjustable height. Special scoop conveyer for automatic hopper filling Special hopper with agitator control with level sensor Pouch style options Center seal pouch with increased panel area Advanced Constant Heat sealing System Specially designed film roll unwinding mechanism for smooth bag pulling Operation with servo motor and control cards. Independent drives for sealing, feeding & film feed operations for optimum performance Less floor space requirement for machine installation. Equipped with variable speed drive for flexibility to offer adjustable output for the machine Bag Unwinding by Lanatex belt drive through servo motors Flexible vertical seal jaw positioning to offer range of variable pack with offering quick change-over facility Suitable for different range of packaging film i.e PE film with or with out Laminate Special safety card to control current for protection electrical / electronics equipment Adjustable bag length by PLC through servo motor and control cards Independent dozing system Independent temperature controller for both seal Centralised lubrication system Jaw's security devise to protect the operator of machine Electric Panel IP-54 Protection Standard. Machine Packaging Capabilities Milk Powder, Pesticide Powder, Detergent Powder, Chemical Powder, as well as all kinds of powder products. Technical Specifications Output Quantity: 100 g - 1000 g 1000 g/5000g Outpt: 20 - 75 Bags/min 15 - 30 Packs/min Filler Accuracy: ± 5 gm Pack / Quantity Range: Min. Bag size (W x L) approx: 120 mm x 150 mm Max. Bag size (W x L) approx: 355 mm x 500 mm Packaging Material: Co-extruded 3 or 5 Layer PE Based or Laminated, Metalize, Aluminum Foil 60 to 140 microns Electrical Requirement: Input Supply: 380 V AC, 50 Hz, 3 ph + N + G Connected Load: 7.2 KVA Peak Power Rating: 6.48 KW Air Requirement: Air Pressure: 6 bar Air consumption: 800 Ltr/min Machine Dimensions along with conveyor (W x D x H) approx.: 1110 mm x 1700 mm x 2400 mm (1300 mm x 1956 mm x 3350 mm) for 5 Kg Weight: 600 kgs (Net) Optional Accessories Customised pack Size Photomark Registration Unit for Panel Printed Films Automatic Pouch Counting System Inert Gas Flushing System Conveyor Date Coding System Extra Magazine Shaft Optional Film End Sensor UV sterilisation of packaging film Programmer cam switch controller Special thermic sealing jaw Impulse jaw Volumetric dozing system Platform English Folding System Extra Conformer for different sizes Air release system
Salient Features Special volumetric cup dozing system control by special gear motor Operator friendly PLC controller with a user friendly GUI Pouch style options Center seal pouch with increased panel area Advanced Constant Heat sealing System Specially designed film roll unwinding mechanism for smooth bag pulling Operation with brake system. Independent drives for sealing ,Feeding & film feed operations for optimum performance Less floor space requirement for machine installation. Equipped with variable speed drive for flexibility to offer adjustable output for the machine. Bag Unwinding by Lanatex belt drive through gear and servo motors Flexible vertical seal jaw positioning to offer range of variable pack with offering quick change-over facility Suitable for different range of packaging film i.e PE film with or with out Laminate Special safety card to control current for protection electrical / electronics equipment Adjustable bag length by PLC and servo motor and control cards Independent dozing system Independent temperature controller for both seal Centralized lubrication system Jaw's security devise to protect the operator of machine Film end sensor Electric Panel IP-54 Protection Standard. Machine Packaging Capabilities Rice, Sugar, Beans, Seeds, Salt, Tea, Spices, Pulses as well as all kind of granule products. Technical Specifications Output Quantity: 1000 g -5000 g Output: 12-40 Packs/min Filler Accuracy: ± 5 gm Pack / Quantity Range: Min. Bag size (W x L) approx: 120 mm x 150 mm Max. Bag size (W x L) approx: 355 mm x 500 mm Packaging Material: Co-extruded 3 or 5 Layer PE Based or Laminated, Metalize, Aluminum Foil 60 to 140 microns Film Reel: Core dia 76 mm & Reel diameter 300 mm max Electrical Requirement: Input Supply: 380 V AC, 50 Hz, 3 ph + N + G Connected Load: 5.5 KVA Peak Power Rating: 5 KW Air Requirement: Air Pressure: 6 bar constant dry air Air consumption: 800 Ltr/min Machine Dimensions along with conveyor (W x D x H) approx.: 1110 mm x 1700 mm 2400 mm (1300 mm x 1956 mm x 3350 mm) for 5kg Weight: 600 kgs (Net) Optional Accessories Customised pack Size Photo mark Registration Unit for Panel Printed Films Automatic Pouch Counting System Inert Gas Flushing System Product discharge conveyor Date Coding System Extra Magazine Shaft Programmer cam switch controller Impulse jaw Platform English Folding System Bucket Elevator Extra Dosing cup Extra Conformer for different sizes Air release system Special Weighing System
PS: This is only the base mat not include the microscope. Features : Insulate heat and resist high temperature up to 500 degrees Absorbent surface protects solder tip and work bench at the same time Made of high-grade silica, resist corrosion, solid and durable Easy to clean with banana oil or panel cleaner Soft texture, easy to use Bring a clean, standardized working images to each communication electronic maintenance master and customer, the working environment becomes clean and tidy, and the working plane design is humanized, The extended platform is 330mm*200mm, it is very convenient for cleaning and repairing sundries, removing, cleaning and replaceing, Multi-function, mult-purpose, mult-type, materials slot tools need to be on this platform, it can be known and meet the needs of the vast number of communictations electronics industry maintenance master. The utility model relates to an automatic memory recovery structure, in particular to a maintenance platform, which is used for the electronic communication service and is made of a flame retardant material and self extinguishing property MSDS. Maintenance platform specifications includes the maintenance activities area, removing slot tools and common maintenance supplies placing slot. The edge part of the maintenance area has a high precision scale square. And it is a plane effect combined with the silicone insulation pad. The removing tool slot is composed of multiple sets of hollow cylinders, multiple sets of concave convex sets, material slot A and material slot B.
T12-D Constant Temperature Electric Soldering Station with LED digital display, 110V-230V 72W 951 Soldering Iron Welding Tool with 3pcs iron tip, Improvement T12-D Constant Temperature Lead-free Soldering Station for mobile phone PCB Welding Repair. Auto sleep, Auto standby, 5 seconds for heating, Immersion tin in 6 seconds, Fast back temperature Enhance temperature in One-button, Adjustable sleep time, Adjustable standby time Five advantages on SFD T12-D soldering iron heat core 1. Compared with ordinary iron tip plating for 10 hours , our soldering iron is electroplated for more than 30 hours 2. Ordinary soldering iron head adopt domestic heating core, while our soldering iron head use imported heating core 3. Ordinary soldering iron tip without any code, but our soldering iron tip uses a unique code, you can trace to the source 4. When ordinary tip heated above 350 degrees, of which the temperature will jump for at least five minutes, and it will continue to jump when the temperature reaches 500 degrees or more. While our soldering iron tip won't jump and can be used directly! 5. The heat transfer of soldering iron head is high, and temperature of the iron tip is accurate. Difference of actual display temperature is not more than 2 degrees
Computer spare parts, electronic spare parts of computer (IC-integrated chips, resistor, capacitor, motherboard, soldering machine & wire) and LED, electical spare parts (street lights, chokes, lamp).
