Mijing Ch5 Desoldering Platform

MIJING C20 Motherboard Layerer test fixture For Phone 12/12 mini/12 Pro/12Pro max. MJ C20 4 IN 1 Phone 12 series logic board function tester for Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper/lower layer tester. MJ C20 test fixture for Phone 12 series motherboard separating testing repair. Function: 1. MJ C20 separating test fixture test platform is used for Phone 12/12mini/12Pro/12Pro max motherboard separating repair. 2. Support motherboard without middle frame test. 3. Accurate alignment : Every test rack has experienced many tests, quality assurance.

Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform with 3.4inch Screen Display for Phone 11 to 13Pro Max Motherboard Repair, Intelligent Desoldering Reflow Degumming Layering Lamination Tin Planting Welding Mobile Phone Curve Heating Tool. Features: 1. Intelligent Desoldering, Reflow, Degumming, Layering, Lamination, Tin Planting, Welding Mobile Phone Curve Heating Tool. 1. 3.4inch Screen Display Monitor temperature changes and realize reflow soldering temperature curve data monitoring. 2. Turbofan blades for heat dissipation, built-in strong wind cooling system. 3. Adopted new MCH ceramic double heating element is adopted, the platform has faster heating, more uniform temperature, and stable performance. 4. 5 professional mode selection, 3 common mode operation. Description: 1. Reflow Soldering Preheating Platform is designed for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow. 2. 5 application scene modes: degumming, layering, lamination, tin planting, and welding. 3. 3 commonly used memory temperatures, automatic recording of the current temperature and manual recording of the current temperature mode. 4. Suits for: Phone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max

Mijing K35 tin planting platform with BGA reballing stencil for Phone 12 Mini 12 Pro Max logic board soldering repair, MJ K35 metal BGA reballing stencil for Phone 12 12 Mini 12 Pro 12 Pro Max BGA PCB welding repair. Product Features : Install the Phone 12/12 Mini/12 Pro/12 Pro Max main board on the platform Cover the Phone 12/12 Mini/12 Pro/12 Pro Max BGA reballing stencil on mainboard Evenly spread tin on the cover of the reballing stencil Remove the reballing stencil cover Take out the motherboard and cooperate with the hot air gun to solidify the tin point. Product Specification : Item Name: MJ K35 Tin Platform Model: K35 Material: Imported synthetic stone material Color: Blue + Silver Size: 120 115 20mm Weight: 350g Suit For: Phone 12/12 Mini/12 Pro/12 Pro Max Application: For Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper / lower layers logic board soldering repair.

Mechanic iT3 Pro intelligent temperature control preheating platform for Phone X-13 PRO Max motherboard layer separating and fitting, Phone Face ID dot projector CPU IC rear camera tin planting BGA desoldering glue removal repair. Mechanic iT3 Pro motherboard layered heating station for Phone X/XS/XS MAX/11/11 PRO/11 PRO MAX/12/12 PRO/12 PRO MAX/12 MINI/13/13 mini/13 Pro/13 Pro Max/Face ID/CPU/IC/Rear camera repair. Features: 1. Suitable for Phone X/XS/XS MAX/11/11PRO/11 PRO MAX/12/12PRO/12 PRO MAX/12 MINI/13/13 mini/13 Pro/13 Pro Max. 2. Used for Phone motherboard layered and fitting, tin planting, BGA desoldering, IC glue removal, dot matrix Face ID repair, rear camera repair. 3. Intelligent adjustable temperature, modular design 4. No air gun and no soldering iron, just plug and use 5. Multiple combination modules, good scalability, easy to expand new modules. 6. Host size: 12*14cm 7. Voltage 110V/220V

Mechanic 900M-T-C3 Mini heating platform for circuit board small IC chips desoldering repair, Mechanic 900M-T-C3 Iron Tips for small components Welding repair tool, it can used for all kinds 936 / JBC / T12 soldering station Advantage : Safety, surface insulation Heat up quickly, long service life Constant temperature High power, easy use, high reliability Application range : Used to heat the internal connector of screen flex cable and the replacement and installation of face ID, flex cable and chips for various phone. It can solve the bulging and deformation of flex cable due to the early replacement of the internal connector and uncontrollable temperature of the air gun effectively.

Sunshine 6 in 1 phone motherboard layered heating platform for Phone X-11 Pro Max CPU, SS-T12A M6 desoldering heating station for Phone X mainboard CPU, Phone logic board frame separate repair tools for Phone X XS XS MAX 11 Pro Max Product Features : Silicone non-slip foot pads and cooling holes : Hollow vents and silicone non-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and efficient heat dissipation. High hardness thick synthetic stone : The main body is made of special synthetic stone material, high temperature resistance, strong and durable. High purity copper film : Ensure uniform and stable heat transfer and heating, and accurate card positioning. Remove glue from CPU and Other components : Support a variety of chips/universal hard disk/fingerprint cable/CPU degumming and tin removal, accurate card position, non-destructive repair.

MFC iREWORK adopt the popular PID automatic, intelligent, high precision control technology. The iREWORK Heating Platform rated by professional technicians in China. MFC team combined with Jovy company and famous GSMHOSTING forum teamed up to build a highly efficient, high-end, intelligent equipment for the maintenance industry, the unique features are mainly: easy operation, safety, intelligence, energy-saving and space-saving. Features: 1. Equipped with high-performance, low-power consumption AVR microprocessor, long service life 2. Low ripple, low noise, low power consumption (no-load loss less than 3W), automatic sleep function 3. Intelligent overload protection to prevent output short-circuit and over-current protection, can restore automatically 4. Imported grade A 300W heating core, built in no node, long life, good linear consistency and high temperature resistant cable 5. Import grade A PT100 temperature sensor, built in high resistance, high temperature resistant cable 6. Comes with 0.96 inch OLED LCD screen, real-time monitoring platform work status and all data 7. The main control comes with overheating protection, and real-time monitoring, real-time display 8. The design of high heat density, pore size curve distribution, heat transfer and heat flow loss accurate, will not overheat 9. Airframe distributed thermal design and equipped with custom heat resistant cooling fan 10. Parts real-time intelligent self-test, such as thermocouple damage, temperature disorders and other warning tips 11. Can be used to standardize the regular iron temperature or hot air gun temperature calibration or ground detection 12. Factory containing general settings (such as glue, CPU, IC soldering and desoldering, touch or LCD temperature setting) 13. Support all the small integrated circuit board components without iron or hot air gun under the condition of perfect welding and sealing off operation (such as A7 A8 A8 A10 CPU, baseband IC or Nand etc.), the original partition or whole heating design 14. Can be used as a preheating station (baking, drying, aging test) to minimize the risk of damage to components during welding or use process 15. Supports fast removal for smartphones and electronic products glass, touch or battery. 16. Custom all intelligent, one key process operation, during which need not to set (such as preheating, removing glue, disassembly, welding) 17. All preset options can customize the settings and perform actions on them 18. Equipped with computer customized software, with visual curves, custom programmable control 19. Intelligent and easy to control without computer or with computer 20. Factory 100% full load aging and testing (including universal fixture) 21. Product design meets EMC and safety compliance test and meets export standards Superior performance and ultra low price, your ideal choice.