Mijing K35 tin planting platform with BGA reballing stencil for Phone 12 Mini 12 Pro Max logic board soldering repair, MJ K35 metal BGA reballing stencil for Phone 12 12 Mini 12 Pro 12 Pro Max BGA PCB welding repair. Product Features : Install the Phone 12/12 Mini/12 Pro/12 Pro Max main board on the platform Cover the Phone 12/12 Mini/12 Pro/12 Pro Max BGA reballing stencil on mainboard Evenly spread tin on the cover of the reballing stencil Remove the reballing stencil cover Take out the motherboard and cooperate with the hot air gun to solidify the tin point. Product Specification : Item Name: MJ K35 Tin Platform Model: K35 Material: Imported synthetic stone material Color: Blue + Silver Size: 120 115 20mm Weight: 350g Suit For: Phone 12/12 Mini/12 Pro/12 Pro Max Application: For Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper / lower layers logic board soldering repair.