Packaging materials like corrugated cardboard boxes, paper bags, corrugated cardboard sheets, kraft paper rolls, paper boards, pizza boxes, biodegradable & compostable bags, jute bags, cloth bags, non woven tote bags and strech foils etc..Product sourcing & procurement, global distribution, custom packaging solution, quality control, supply chain management, export documentation & compliance, after sales support
Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another. The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components. Additional advantages of pcb bare board are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics. Use of Rigid-Flex circuit boards can reduce the total cost of the final product. Rigid-Flex circuit boards give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits. As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance.
Layers : Sample 1~32 / Mass Production 1~20 Size :Max shipping size is 600mmx550mm , +/-0.15mm Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm (Max) 3.6mm(2.2~3.6mm depends on material), +/-10% Copper Thickness :1/3~5oz (Depends on material) Impedance Control :+/-10% Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm PTH+/-0.075mm NPTH +/-0.05mm Aspect Ratio : Sample :10:1 / Mass Production :8:1 Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm The tolerance followed by IPC-6012 Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated Spacing between Pads : Min :8 mil
Product Parameter Materials: FR4+Polyimde Overall Board Thickness:1.75mm Layer:4 Surface finished: ENIG Features: Min hole: 0.20mm Hybrid board 4layers flex+4layers rigid pcb
Rigid-Flex PCB for Medical equipment
NAME: 6 LAYERS RIGID-FLEXIBLE PCB Board thickness: 0.6MM Copper thickness: 0.5OZ Minimum line width/space: 3/3 mil Minimum drilled hole diameter: 0.10MM Surface finish: ENIG Special process: mix lamination , laser drilling
Product Name: Sodium permanganate Use level: Industrial Content: 40 (%) CAS Number: 10101-50-5 Molecular formula:NaMnO4 Molecular Weight: 141.93 Appearance: purple liquid. A density of 1.36 ~ 1.39 g / cm3, soluble in water, ethanol and ether, soluble in liquid ammonia. Decomposition in alkali. Strong oxidizing. And chemical properties similar to potassium permanganate. Purposes: as oxidants, disinfectants, fungicides and phosphorous antidotes. Toluene is also used to manufacture saccharin, o-toluene sulfonamide and organic synthesis and purification of phenol wastewater treatment. Can be used for circuit boards, metal surface cleaning, the conductive film cleaning to remove grease, electrolytic manganese dioxide, chemical fiber finishing, electroplating addition to hydrogen sulfide and other odors, as well as water treatment and so on. Packaging and storage: Industrial Pails barrel, net weight 25kg plastic drum, 250kg steel-plastic composite barrels, 1250kg IBC barrels packaging. Store in a cool dry place. Quality Standard: Â Items index Sodium permanganate (NaMnO4) Content / (%) 40 Water-insoluble content / (%) 0.01 Potassium (K) content / (%) 0.22 pH value 6 ?8 Density / (g/cm3) 1.36 1.39 Chloride (Cl) content / (%) 0.02
Commodity:Sodium persulfate Molecular Formula : Na2S2O8 Molecular weight : 238.13 Description Sodium persulfate is a white,crystalline,odourless salt.It is used as initiator for the Polymerization of monomers and as a strong oxidizing agent in many applications.It has the particular advantage of being almost non - hygroscopic,of having a particularly good storage stability as a result of its extremely high purity and of being easy and safe to handle. Transportation Road/Rail transport : GGVS,GGVE,ADR,RID/CLASS 5.1 Sea transport : GGV Sea/IMDG code : CLASS 5.1 Page 5185,UN no.1505 Water hazards class 1(slight water hazard) All information is given in good faith,but without warranty,since the conditions of use are outside our control. Verification by the user is recommended.Freedom from patent restriction cannot be assumed. Package (1) In 25kgs net multiple paper bags with one PE bag inner (2) In 25kgs net PE bags (3) In 25kgs net woven bags with two PE bags inner (4) In 1000kgs net big woven bags with one PE bag inner The above package is also with a pallet 1000kgs each. Storage NPS(SPS) is not combustible but assists combustion materials due to release of oxygen.Provided it is stored under appropriate condition.It must be stored dry in closed containers and protected from direct sunlight,heat and humidity.Impurities such as dirt,rust or traces of metal and reductants may cause catalytic decomposition.The product as supplied or in solution needs to be handled with appropriate care.The eye,skin and clothes must be protected when working with NPS(SPS) as damp powder or aqueous solution has a bleaching and slightly corroding effect. Application Polymerization : Initiator for the emulsion or solution Polymerization of acrylic monomers,vinyl acetate,vinyl chloride etc.and for the emulsion co-polymerization of styrene,acrylonitrile,butadiene etc. Metal treatment : Treatment of metal surfaces(e.g. in the manufacture of semiconductors; cleaning and etching of printed circuits),activation of copper and aluminium surfaces. Cosmetics : Essential component of bleaching formulations. Paper : modification of starch,repulping of wet - strength paper. Textile : Desizing agent and bleach activator - particularly for cold bleaching.(i.e.bleaching of Jeans). Others : - Chemical synthesis - Water treatment(decontamination) - Waste gas treatment,oxidative degradation of harmful substances(e.g.Hg) - Disinfectant ITEMS SPECIFICATIONS Appearance white crystalline salt Assay 99.0% w/w min Active oxygen 6.65% w/w min Chloride and chlorate(as CL) 0.005% w/w max Ammonia (NH4) 0.05% w/w max Manganese(Mn) 0.0001% w/w max Iron(Fe) 0.001% w/w max Heavy metals(as Pb) 0.001% w/w max Moisture 0.05% w/w max Decomposition of the product as supplied at above 65C Recommended storage temperature Normal Temperature Storage stability as from date of delivery 12 months
Material: fr-4+pi Layer count£º6 layer Board thickness:1.60mm Min line/space: outer layers:0.09/0.09mm Inner layers: 0.075/0.075mm
Rigid Flex PCB High Quality Flexible Rigid PCB, High Quality Flex PCB, Aluminum PCB, Metal Based PCB, Thick Copper PCB, High Tg Fr4 PCB, Rigid Circuit Manufacturer Layer:3L Copper weight: 1/H/1OZ FPC thickness: 0.13mm FR-4 thickness: 0.6mm Finished thickness: 0.75mm Surface Finish: ENIG Special technology�?Inner gold fingers We can OEM high quality flexible rigid PCB, high quality flex PCB, aluminum PCB, metal based PCB, thick copper PCB, high tg Fr4 PCB, rigid circuit.
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material: Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil: Ed/ra Min. Line width: 2 mil Min. Line spacing: 2 mil Min. Hole size: 0.2mm Max. Board size: 800x400mm Min. Board thickness: 0.1mm Min. Solder mask thickness: 10um Solder mask types: Green, yellow, black, white, blue, red and clear Profiling: Punching, routing, v-cut Soldering thermal resistance: 300°c/10 seconds Peeling strength: =1.4kg/cm Surface resistance: 105mo Insulation resistance: 105mo Dielectric strength: 9.8x105v/cm Flammability: Ul-94v-0 Performance test: 100% electrical and electricity performance test
Okeir is a professional pcb manufacturer in Shenzhen,China, main business is PCB, fpc, rigid flexible pcb, turnkey pcba assembly service, We are committed to continuous improvement and customer satisfaction by providing exceptional service and technical support in the production and timely delivery of quality products, which include PCB assemblies, cable assemblies and full box assemblies and electronic/electrical components.welcome your inquiry by
1.Working priciple. The processing is crushing --pulvering --separating , form whic the mixture of metal and non-metal is gained. Besides, separator combine with dust removl syesetm , due to different secifice gravity of materalis , non-metal such as dust , and grains which bears smaller graviry are taken away by dust removal sysetm, at the same time, the metal with lager gravity go into finished product recovery zone, thus the separation of metal and non-metal materials is achieved. 2.Advantage of pcb assembly 1).High recovery percent of metal , of which , the purity is up to 98%. 2).The price is only 1/5-1/3of that of the simaller product 3).The recovery rate of copper is about 3%-5% higher than other manufacturers of the sort 4).The unit consumption of energy to trest one ton of waste and unused pcb boards is only about 3/5 of that of domestic product alike 5).Easy operation, no polluction and noise, flexible for layout. Type total output(kg/h) total power floor space Sx-500a 300-500 55 90 Sx-500b 200-400 50 70 Sx-1001 400-800 75 120 Sx-1002 800-1500 150 200 Sx-1003 800-1500 120 150 ***
1Layer1-30 layer 2MaterialFr-4, cem-1, cem-3, hight tg, fr4 halogen free, fr-1, fr-2, aluminum 3Board thickness0.2mm-7mm 4Max.Finished board side500mm*500mm 5Min.Drilled hole size0.2mm 6Min.Line width0.075mm(3mil) 7Min.Line spaceing0.075mm(3mil) 8Surface finish/treatmentHals/hals lead free, chemical tin, chemical gold, immersion gold inmersion silver/gold, osp, gold plating 9Copper thickness0.5-6.0oz
1. Layer count: 1-30 layer. 2. Board thickness: 0.1-6.5MM 3. Impedance control:+/-5% 4. Min line width/space of outer layer 4/4mil 5. Min line width/space of inner layer : 3/3mil 6. Max size :24¡±x40¡± 7. Min hole dia. : 0.2mm (normal) , 0.075mm(laser drilling) 8. Toleranceof hole dia. : +/-2 mil 9. Max copper thickness : 8 oz 10. Base Materials :CEM1, FR1, FR4, Rogers, Arlon, Taconic etc. 11.Surface finishing : HAL, HAL Lead free,Immersion Gold,Immersion silver etc. vacuum
FPC PCB flexible printed circuit board
2-24 Layers Book/Air-gap/Fly-tail Unsymmetrical/Semi-Flex Width of Flexible Zone 3mm(min) Dimension Accuracy �±0.05mm(min) Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM's in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
We OffeCircuit Boardr a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs Process Item Craft Capacity Prepares materials Base Material FR4, CEM-1, Aluminium, High Tg Material, Halogen-free Material Lamination press Layer Count 1-12Layers Thickness 0.2-3.0mm Drill Min.Hole Diameter 0.15mm (mechanical drill), 0.1MM (laser drill) PTH Diameter Tolerance + / - 3mil NPTH Diameter Tolerance + / - 2mil Outer layer Min.Line/Space 3.5mil/3.5mil Copper Thickness 1- 6oz Impendence Impedance tolerance ±10% (±5%(Need assessment) Solder Masking Min.Solder Dam 0.1mm Min.Solder Mask Opening 0.075mm Color Green, White, Red, Yellow, Black, Blue Surface Treatment LF-HASL, OSP,Ni/Au Enig,Immersion Tin, Immersion Silver, carbon oil; Out-Line Profiling Profile Tolerance + / - 0.12MM V-cut Remain Thickness Tolerance + / - 0.1MM V-cut Angle Tolerance + / - 5° Testing E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing Final Product Thickness Tolerance + / - 10% Warpage Tolerance + / - 0.75% Lead Time Double layer PCB Multilayer PCB Mass production Normal 6 work days Normal 8 work days Double layer 9-12 work days Urgent 3 work days Urgent 6 work days Multilayer 12-15 work days Email:sales5@(keyoupcb.com) Learn more from our website:www.keyoucircuit.com ADD:Room K221,jinhetian Center,QINGHU AREA,SHENZHEN, Guangdong,China
Layers: 2Rigid + 2flex + 2Rigid design Material: FR4 middle TG + Dupont AP8515R Thickness: Rigid 0.80mm Flex 0.20mm with stiffener Surface treatment: immersion gold Apply for surveillance producation Solder mask: Green + Coverlay Legend: White Rigid-flex Printed circuit board manufacturer from China
This Medical Rigid-Flex FPC illustrates how designers use flex to reduce board thickness as well as package size and weight, and incorporate connectors into the bare board design. rena at popwintech doc com Application: Wearable Insulin Pump Size: 3 by 3 Layers: 6 Overall, 2 Flex Materials: Adhesiveless Flex, Polyimide Core, Polyimide No-Flow Prepreg Traces: 4/4 Innerlayers - 4/4 Outerlayers Minimum Hole: 0.010 Minimum Pad: 0.022 Thickness: 0.030 vacuum-packed for inner,thicker carton for outer
