Single Side : Maximum shipping Panel Size 470mm*570mm Finished Board Thickness : Minimum Board Thickness : 0.6mm+/-0.1mm , Maximum Board Thickness : 2.0mm+/-10% Dielectric Material : Heat Conductive Glue / FR4 Aluminum Type : 5052 Copper Thickness : 1/2~2oz Trace Width / Spacing : Minimum Line Width / Spacing(Internal&External) 0.1mm ,The tolerance followed by IPC-6012 Surface Finish : Immersion Gold(Ni/Ru) 0.025~0.1um /Lead Free HASL (Min. 2.5um)/OSP (Entek CU106A) 0.2~0.5um Solder Mask : LPI Test : Hi-Pot Test
Layers: FPC 1~4 L Finished Board Thickness with Copper : Min 0.075mm (1L) / Max 0.3mm (2L) Finished Board Thickness Tolerance: �±0.02~0.04mm Impedance Control :+/-10% Base Copper Thickness : Standard : 1/3oz,1/2oz,1oz / Spcial:2oz Base Film Thickness:Standard:0.5mil , 1mil / Special : 2mil Stiffener:PI / FR-4 /SUS Finished Hole Diameter:Min { }0.15mm / Max { }6.30mm Finished Hole Diameter Tolerance PTH�±3mil(�±0.075mm) npth�±2mil(�±0.05mm)
Layers : Sample 1~32 / Mass Production 1~20 Size :Max shipping size is 600mmx550mm , +/-0.15mm Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm (Max) 3.6mm(2.2~3.6mm depends on material), +/-10% Copper Thickness :1/3~5oz (Depends on material) Impedance Control :+/-10% Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm PTH+/-0.075mm NPTH +/-0.05mm Aspect Ratio : Sample :10:1 / Mass Production :8:1 Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm The tolerance followed by IPC-6012 Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated Spacing between Pads : Min :8 mil
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Hankook Smart Flex AH35 FEATURES AND BENEFITS All weather traction Enhanced controllability Fuel efficient drive Excellent durability The Hankook Smart Flex AH35 is a highway terrain all-season tire manufactured for commercial vehicles. The tyre model is made to be mounted on the vehicle's steering axle. Hankook Smart Flex AH35 - Key Features All-Weather Performance: The tire offers reliable traction in dry, wet, and winter conditions, thanks to its wide grooves and 3D sipes, which also prevent hydroplaning. Enhanced Control: The ribbed tread design ensures constant road contact, improving steering response and driving stability. Fuel Efficiency: The optimized 3D siping reduces rolling resistance, leading to lower fuel consumption and CO2 emissions. Durability: Reinforced carcass structure maintains the tire's shape under heavy loads, extending tread life and making it cost-efficient.
Brand Name: strongtimes Number of Layers: 4 Base Material: FR-4 Copper Thickness: 3mil Board Thickness: 1.6mm Min. Hole Size: 4mil Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: lead free hal Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided, double-sided and multilayer PCB of high precision, high density and high reliability.
What is HDI PCB High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices. Advantages of HDI PCB The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
