This Medical Rigid-Flex FPC illustrates how designers use flex to reduce board thickness as well as package size and weight, and incorporate connectors into the bare board design.
rena at popwintech doc com
Application: Wearable Insulin Pump
Size: 3 by 3
Layers: 6 Overall, 2 Flex
Materials: Adhesiveless Flex, Polyimide Core, Polyimide No-Flow Prepreg
Traces: 4/4 Innerlayers - 4/4 Outerlayers
Minimum Hole: 0.010
Minimum Pad: 0.022
Thickness: 0.030
vacuum-packed for inner,thicker carton for outer
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we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
This Medical Imaging board for a medical device that is eighteen layers and presents difficult registration due to the number of layers and board's dimensions. Application: Medical Imaging Size: 4.5 by 22.25 Layers: 18 Overall, Four Layers Flex with Four Layers of Epoxy Silver Shielding Materials: Adhesiveless Flex, Polyimide Core, Polyimide No Flow Prepreg Traces: 7/4 Innerlayers - 7/5 Outerlayers Minimum Hole: 0.024 Minimum Pad: 0.040 Thickness: 0.093 +/- 0.005 vacuum-packed for inner,thicker carton for outer
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life. Jinsung Electronics produced flex and rigid-flex printed circuit boards that assisted physicians and healthcare professionals to offer more functions, operational easiness, and smaller size packages through innovation and collaboration with customers.
Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another. The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components. Additional advantages of pcb bare board are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics. Use of Rigid-Flex circuit boards can reduce the total cost of the final product. Rigid-Flex circuit boards give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits. As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance.
Layers : Sample 1~32 / Mass Production 1~20 Size :Max shipping size is 600mmx550mm , +/-0.15mm Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm (Max) 3.6mm(2.2~3.6mm depends on material), +/-10% Copper Thickness :1/3~5oz (Depends on material) Impedance Control :+/-10% Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm PTH+/-0.075mm NPTH +/-0.05mm Aspect Ratio : Sample :10:1 / Mass Production :8:1 Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm The tolerance followed by IPC-6012 Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated Spacing between Pads : Min :8 mil
Product Parameter Materials: FR4+Polyimde Overall Board Thickness:1.75mm Layer:4 Surface finished: ENIG Features: Min hole: 0.20mm Hybrid board 4layers flex+4layers rigid pcb
Multilayer pcbs Major material: fr-4, nelco, htg>170, high cti value, halogen free Minimum board thickness: Double sided: 0.2mm Multilayer: 0.4mm Maximum board thickness: Double sided: 2.4mm Multilayer: 3.2mm Surface finishing: Hal Lead-free hal Flash gold Selective gold Immersion gold (enig) Immersion tin Immersion silver Carbon print Gold fingers Entek (osp) Flux coating Peelable mask Gold plating (hard gold) Enig thick gold Solder mask plugged hole Copper finished thickness: 1/2 oz to 6 oz Minimum hole size: 0.25mm Minimum line width/spacing: 0.1 Standard: rohs, sgs, ukas, iso14001, dnv, ul We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Packing: vacuum packing
