Polyaminoamide type epoxy curing agent. Mixtured resin of hardner with an epoxy resin maintain a rather longer pot-life, and provides its cured products with well balanced cured properties. hardner is a therefore recommended to be employed for such applications as general adhesives and structural adhesives in construction works.
Low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, moderate pot life, good colour stability and high gloss films are required.
It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, moderate pot life, good colour stability and high gloss films are required.
A low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required.
A high viscosity, reactive polyamide resin designed for use with liquid epoxy resins to achieve cure at room temperature. It is suitable for use in adhesives, civil engineerings, high solids anti-corrosive coatings for marine and maintenance coatings where excellent adhesion, good flexibility and toughness, good water and corrosion resistance are required.
Modified cycloaliphatic amine intended for use as a room temperature curing agent for liquid epoxy resins special features of this curing agent include its low viscosity, light colour, good colour stability and high gloss.
A polyaminoamide curing agent for liquid epoxy resin to achieve slow cure at ambient temperarure. It has a high molecular weight and provide the cured products with high orders of flexibility adhesion good chemical and water resistance. The major applications are for general adhesives civil engineering and construction.
A polyaminoamide curing agent for liquid epoxy resin to achieve fast cure at ambient temperarure. It has a high molecular weight and provide the cured products with high orders of flexibility adhesion good chemical and water resistance. The major applications ofare for general adhesives civil engineering and construction.
A low viscosity, modified aliphatic polyamines epoxy curing agent. It has been designed for use in solventless coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required.
A self-emulsifiable type epoxy curing agent The mixture with liquid type epoxy resin provides stable emulsion, and can be used for pollution-free coating containing no solvents in its system. Outstanding is penetrating power into absorbent concrete, steel plate and other inorganic substrates. Among them , it is a water dilutable, such application as concrete primer is most recommendable.
A self-emulsifiable type epoxy curing agent The mixture with liquid type epoxy resin provides stable emulsion, and can be used for pollution-free coating containing no solvents in its system. Outstanding is penetrating power into absorbent concrete, steel plate and other inorganic substrates. Among them , as it is a water dilutable, such application as concrete primer is most recommendable.
Modified Polyamines KINGCURE X-2001 is a mannish type Epoxy Resin hardener. Based on aromatic amine developed for low viscosity fast curing. KINGCURE X-2001 can be used in all normal amine reactions . It is a slightly yellow product and has only limited solubility in water. The reactivity with epoxy resin is so high that no accelerator are required The cure takes place at high atmospheric humidity at temperature down to 5and even under water. Viscosity(mPas /25C) ,200 ~ 2,500.
Modified Polyamines KINGCURE 367-KV is a modified aromatic polyamines type curing agent for liquid epoxy resin. Itis a medium viscosity and pot life, The surface hardness is more than KINGCURE X-165A to the mixed resin .The major applications solventless coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required. Viscosity (mPas /25C ) 100 ~ 400 .
Modified Polyamines KINGCURE 800-C is a mercaptan terminated liquid polymer which is imparts rapid-cure characteristics to epoxy resins in combination with selected amines these systems are unique in that they also provide rapid cure rates at low temperatures and thin film ,application in construction adhesives(Bonding compounds)5min fast-setting adhesives. Viscosity (mPa s/ 25C ) 10,000~20,000 .
Modified Polyamines KINGCURE N-768 is a rapid room temperature curing agent for epoxide resins. It is a stable liquid activated amine of particular use for solvent-free coatings, floor patch repair kids,fast-setting adhesives,cold weather patching compounds and as an accelerator for other amine and polyamide cures Viscosity (mPa s/ 25C ) 150 ~ 250 .
Modified Polyamines KINGCURE B-311 is a low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required. Viscosity (mPa s , 25C) 300 ~ 700.
Polyamide For Hot Melt KINGMIDE H-140HP is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. It is easy to soluble in mixed organic solvent such as toluene and alcohol type solvent. This resin has the characteristics of good mechanical strength, good heat resistance and flexibility. It is suitable for use in sealing and electric parts adhesive . Viscosity (mPa�·s / 200C) 5,000 ~ 10,000.
Polyamide For Hot Melt KINGMIDE H-170HV is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. KINGMIDE H-170HV is easy to soluble in mixed organic solvent suchas toluene and alcohol type solvent. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance and high adhesive strength and good toughness are particularly needed. Viscosity (mPa s / 200 C) 3,000 ~ 7,000.
Polyamide For Hot Melt T-558-N is a solid-type fatty polyamide resin especially designed for HOT-MELT STRUCTUAL ADHESIVE uses. It has superior processing properties for its ready-to-apply nature due to the lower molten viscosity. Optimum application temperature of T-558-N is in the range of 180C~200C. T-558-N shows excellent adhesion onto various types of plastics, and steel, as well as onto many other surfaces, giving very tough bonding and sealing strength. T-558-N may be applied either by hand or manually operated by hand-guns. An automatic dispensing equipment with a nozzle or a wheel applicator may also be benefited. Viscosity (mPa s/ 200C ) :500 ~ 800.
Polyamide For Hot Melt KINGMIDE H-175SP is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. KINGMIDE H-175SP is easy to soluble in mixed organic solvent, such as toluene and alcohol type solvent. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance and high adhesive strength and good toughness. Viscosity (mPa s / 232C) 3,000 ~ 6,000.
