PRODUCT HIGHLIGHTS Graphite filled electrically conductive Non-magnetic Offers good lubricity Ideal for static dissipation and grounding First-rate dimensional stability Very good shielding against EMI/RFI Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1085-1 offers a volume resistivity of 50 - 100 ohm-cm. This makes it ideal for static dissipation, grounding and EMI/RFI shielding applications. Being graphite filled, this product is non-magnetic in nature and offers slight lubricity. It offers an extensive serviceable temperature range of -50°C to +120°C. It is a phenomenal adhesive that offers superb physical strength properties and adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical, it also offers astounding chemical resistance to a variety of acids, bases, oils and water. Part A and Part B are black in color. Owing to its versatile performance, KB 1085-1 is widely used in electronics, aerospace, semiconductor, microwave and many OEM applications where a non-metallic conductive epoxy is required. z
PRODUCT HIGHLIGHTS Superior optical clarity Very good flow properties Withstands very high temperatures Outstanding mechanical strength properties Excellent electrical insulation properties Phenomenal resistance to various chemicals Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 12 - 24 hours and cures quickly at elevated temperatures. It can be cured easily by adding heat at 60°C - 70°C for 8 - 10 hours or 80°C - 100°C for 60 - 90 minutes or 125°C for 30 - 60 minutes. In order to optimize its performance properties, it is highly recommended to post cure at 100°C - 150°C for 3 - 4 hours. KB 1372 LP is specially formulated for resistance to harsh chemicals. It can hold up to many aggressive chemicals, including water, fuels, oils, solvents, acids and bases. Additionally it is optically clear and cures rigid. This superior adhesive fosters outstanding physical strength and electrical insulation properties. It offers very low shrinkage upon cure and excellent flow properties. KB 1372 LP is widely used in optical, optoelectronic, electronics, fiber-optic and aerospace industries, where optical clarity, low exotherm and chemical and high temperature resistance are key requirements. z
PRODUCT HIGHLIGHTS Superior thermal conductivity Excellent toughness Convenient 1:1 mix ratio First-rate thermal conductivity Exceptional electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°C to +200°C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength (> 3,300 psi). TUF 1621 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part A and Part B are off-white in color. TUF 1621 AOHT is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. z
PRODUCT HIGHLIGHTS Unrivaled electrical conductivity Offers cost effectiveness Very good shielding effectiveness Resists more than 370°C Effective moisture barrier Ease of application Kohesi Bond KB-SS-SCN is a silver coated nickel filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers very high levels of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI), along with cost effectiveness. Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. Shielding effectiveness is measured by attenuation, which refers to the difference in an electromagnetic signal's intensity before and after shielding. The unit of measurement is in decibels (dB). Achieving shielding at higher frequencies is extremely challenging. From 1-2 GHz, KB-SS-SCN's effectiveness is in the range of 75-42 dBs, similar to an aluminum reference. This rating slowly declines to 56-42 dBs at 2-15GHz and further down to 50 dBs at 18 GHz, at which point it stabilizes. It should be noted that the decibel range of attenuation falls along a logarithmic scale. A 10 dB difference in attenuation indicates a 10 times change in shielding effectiveness. KB-SS-SCN has a wide serviceable temperature range of -18°C to +370°C. It is a water based system, making it relatively non-toxic. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80°C for 1-2 hours. z
PRODUCT HIGHLIGHTS Exceptionally high Tg Very good flow properties Superior chemical resistance Long working life at room temperature Exceptional electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures. It takes 4 - 6 hours to cure at 70°C, 20 - 40 minutes at 100°C and 10 minutes at 125°C. KB 1372-LO is capable of passing NASA standards for low outgassing (ASTM E-595). It offers very long working life at room temperature, allowing to bond large parts. It has an extensive serviceable temperature range of -50°C to +230°C. This phenomenal adhesive fosters outstanding mechanical strength properties, along with dimensional stability. KB 1372-LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents and other chemicals. Part A is clear in color and Part B is dark brown in color. KB 1372-LO is widely used in applications requiring excellent chemical resistance at elevated temperatures, long open time and outgassing properties. z
PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Excellent flow properties Superior dimensional stability Exceptional electrical insulation properties Easy mix ratio of 1:1 by weight or volume Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 AOLV-1 offers an extensive serviceable temperature range of -50°C to +120°C. Also, it is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 AOLV-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1631AOLV-1 also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its remarkable performance and ease of use KB 1631 AOLV-1 is widely used in electronics, optoelectronic, major OEM and similar applications. z
PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Thixotropic Paste Superior dimensional stability Exceptional electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +200°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications. z
PRODUCT HIGHLIGHTS Easy mix ratio of 1:1 by weight or volume Outstanding dimensional stability Superior thermal conductivity High lap shear strength (> 2 100 psi) Nickel filled electrically conductive 100% solids system Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1686 M offers a volume resistivity of 5 - 10 ohm-cm. It is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive serviceable temperature range of -50°C to +120°C. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 - 1.4 W/m/K), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE). Owing to its versatile performance, KB 1686 M is widely used in electronics, aerospace, electrical, semiconductor, microwave and many OEM applications. TYPICAL APPLICATIONS : Bonding, Sealing, Coating z
PRODUCT HIGHLIGHTS High glass transition temperature Resists thermal and mechanical shocks Very good flow properties Superior chemical resistance Exceptional electrical insulation properties Phenomenal toughness Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. TUF 1452 HT-2 is a toughened system, offering low exotherm and a long working life. It can withstand multiple cycles of thermal and mechanical shocks. It offers an extensive serviceable temperature range of -60°C to +220°C. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is suitable for medium sized castings. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. Part A has a tan-brown color and Part B has an amber color. TUF 1452 HT-2 is widely used in the electronics, aerospace and various OEM applications. z
PRODUCT HIGHLIGHTS Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated temperatures Superior dimensional stability Exceptional electrical isolator Unlimited working life at room temperature Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 RLV offers an extensive serviceable temperature range of -50°C to +180°C. This product's exquisite flow properties makes it ideal for use in underfill, potting and encapsulation applications. Being a one component system, it provides ease of application and also adheres well to an encyclopedic variety of substrates including metals, ceramics, most plastics and glass. It provides sterling mechanical strength properties and dimensional stability. KB 1613 RLV offers phenomenal thermal conductivity of 1 - 1.2 W/m/K. In addition to superior electrical insulation, KB 1613 RLV also offers astounding chemical resistance to a variety of fuels, oils and water. It has a light yellow color, but it can be color matched to your specifications upon request. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 RLV is widely used in electronics and microelectronics packaging and assembly applications. TYPICAL APPLICATIONS : Underfill, Potting, Encapsulation, Sealing, Coating Packing : Cans, Pails, Syringes z
PRODUCT HIGHLIGHTS Superior thermal conductivity Very good flow properties Withstands cryogenic shocks and cycling Outstanding mechanical strength properties Excellent electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 - 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90°C for 3 - 5 hours. KB 1039 CRLP-AO is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. Part A is black and Part B is off white in color. KB 1039 CRLP-AO is widely used in applications where thermal conductivity, low outgassing and cryogenic serviceability are key requirements. TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Packing : Cans and Pails z
PRODUCT HIGHLIGHTS Superior thermal conductivity Very low coefficient of thermal expansion Phenomenal dimensional stability Excellent flow properties Outstanding electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. Its stellar heat transfer capabilities and flow characteristics make it fitting for potting applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040 AN-1 can withstand severe thermal cycling and provides superior physical strength properties and dimensional stability. It offers an extensive serviceable temperature range of -50°C to +120°C. KB 1040 AN-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has a clear color. Owing to its remarkable performance and vacuum compatibility KB 1040 AN-1 is widely used in aerospace, electronics and related industries. TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Packing : Cans and Pails z
PRODUCT HIGHLIGHTS Very high thermal conductivity Low coefficient of thermal expansion Superior dimensional stability Outstanding physical strength properties Exceptional electrical insulation properties Very good flowability Kohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures. KB 1040 AOHT offers an extensive serviceable temperature range of -50°C to +200°C. It is a phenomenal adhesive that offers outstanding physical strength properties and dimensional stability. It offers first-rate compressive strength of over 20,000 psi at room temperature. KB 1040 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of solvents, oils and water. Part A has an off-white color and Part B has a clear color. Owing to its high thermal conductivity and very low CTE, KB 1040 AOHT is widely used in electronics, aerospace, optical, semiconductor and various OEM applications requiring effective heat transfer capabilities. TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Encapsulation, Potting Packing : Cans and Pails z
PRODUCT HIGHLIGHTS Superior optical clarity Excellent flow properties Outstanding adhesion to plastics Bonds without crazing or stress cracking Exceptional electrical insulation properties Stellar dimensional stability Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040 P is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.55. It offers an extensive serviceable temperature range of -50°C to +120°C. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure. KB 1040 P adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B are clear in color. KB 1040 P is widely used in optical, optoelectronic, fiber-optic, electronics, aerospace and related industries especially when plastic substrates are being used. TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Packing : Cans, Pails, Gun Applicator, Syringes z
PRODUCT HIGHLIGHTS Outstanding optical clarity Cryogenically serviceable Superior resistance to a variety of chemicals Tremendous mechanical strength properties Exceptional electrical insulator Capable of passing NASA low outgassing Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. The highlight of this products is its superior optical clarity and its capability of passing NASA low outgassing test. In addition, this product offers very good flow properties, allowing it to be applied in extremely thin layers. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040-2 can be serviced cryogenically. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +150°C. It is a phenomenal adhesive that offers outstanding physical strength properties. KB 1040-2 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and dimensional stability, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. This unique product's vacuum compatibility, light transmission capability and strength makes it ideal for use in aerospace, electronics, optical, fiber-optic and various OEM applications. TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Encapsulation, Potting Packing : Cans, Pails, Syringes and Gun Applicator z
PRODUCT HIGHLIGHTS Silver filled electrically conductive Cryogenically serviceable Superb mechanical strength properties First-rate peel strength Capable of passing NASA low outgassing Unlimited working life at room temperature Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical as well as thermal conductivity. It cures in merely 60 - 80 minutes at 120°C and even faster at higher temperatures. TUF 1820 HTS offers an extremely wide serviceable temperature range of 4K (-269.15°C) to +200°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties as well as outstanding dimensional stability. TUF 1820 HTS is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It has a silver gray color. It also extends first-rate chemical resistance to a variety of acids, bases, fuels and water. Owing to its dazzling performance, capability of passing NASA low outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, optoelectronic, aerospace, specialty OEM and various vacuum based applications. TYPICAL APPLICATIONS : Bonding, Sealing Packing : Cans, Jars, Pails, Syringes z
PRODUCT HIGHLIGHTS High purity silver conductive Tremendous toughness Cryogenically serviceable Exceptional peel strength Superior thermal conductivity Withstands severe shocks Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 AT-S can withstand severe thermal cycling, shocks aznd vibrations even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +135°C. It is a phenomenal adhesive offering outstanding physical strength properties and peel strength. KB 1031 AT-S adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a silver - gray color. KB 1031 AT-S can be applied with minimal dripping; however it can be made more flowable by adding 5 - 10% of solvent like acetone or xylene. KB 1031 AT-S is widely used in electronics, microwave, aerospace, semiconductor among various industries. TYPICAL APPLICATIONS : Bonding, Sealing, Coating Packing : Cans
PRODUCT HIGHLIGHTS Serviceable up to 340°C Admirable chemical resistance Excellent flow properties Low exotherm upon curing Superior electrical insulation Unlimited working life at room temperature Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150°C for curing, it can achieve faster cures at elevated temperatures. KB 1427 HT offers an extremely wide serviceable temperature range of -60°C to +340°C, with a roaring glass transition temperature (Tg) of 220°C â?? 230°C. This productâ??s exquisite flow properties and unlikely low exotherm makes it ideal for use in casting well beyond 1/2 inch thicknesses. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides first-rate mechanical strength properties and dimensional stability. In addition to superior electrical insulation, KB 1427 HT also offers astounding chemical resistance to a variety of fuels, oils and water even at higher temperatures. It has a tan color. It is highly recommended to post cure the epoxy at 180°C for 2 â?? 12 hours in order to achieve optimum properties. Owing to its magnificent performance and ease of use, KB 1427 HT is ideal for use in aerospace, oil and chemical processing, electronics and various OEM applications. TYPICAL APPLICATIONS : Bonding, Coating, Sealing, Casting Packing : Cans, Syringes, Pails and Gun Applicator
PRODUCT HIGHLIGHTS Superior shear strength properties Wide serviceable temperature range Extremely fast cure Outstanding dimensional stability Superb electrical insulator Unlimited working life at room temperature Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 HT offers an extensive serviceable temperature range of -50°C to +200°C. This product can be easily stored at room temperature or in a refrigerator. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. KB 1613 HT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, KB 1613 HT also offers phe-nomenal chemical resistance to a variety of acids, bases, fuels, oils and water. This epoxy is available in a non-drip, non-sag viscosity which can even be applied on vertical surfaces without dripping. It has a tan/ brown color. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 HT is universally used in electronics, electrical,aerospace and various other industries. TYPICAL APPLICATIONS : Bonding, Sealing, Coating Packing : Cans, Pails, Syringes
PRODUCT HIGHLIGHTS Superb electrical insulation Snap curing Impressive chemical resistance Castable up to 1/4 inch thicknesses Glass transition temperature (Tg) of 120°C Unlimited working life at room temperature Kohesi Bond KB 1427 HT-3 is an exclusive one component epoxy system that can cure completely in 2 - 3 minutes at 150°C. Although it requires a minimum temperature of 120°C for curing, it cures equally fast (3 - 5 minutes) at that temperature. KB 1427 HT-3 offers an extremely wide serviceable temperature range of -50°C to +200°C, with an impressive glass transition temperature (Tg) of 120°C. This product's unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C. KB 1427 HT-3 also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding mechanical strength properties and dimensional stability. In addition to superior electrical insulation, KB 1427 HT-3 also offers first-rate chemical resistance. It has a yellow - brown color. This product is available in a paste version as well as in a toughened version for enhanced resistance to mechanical shock and thermal cycling. Owing to its splendid performance and ease of use, KB 1427 HT-3 is ideal for use in aerospace, electronics, chemical processing and various OEM applications. TYPICAL APPLICATIONS : Bonding, Sealing, Potting, Encapsulation Packing : Cans, Pails, Syringes
