PRODUCT HIGHLIGHTS
Superior thermal conductivity
Very good flow properties
Withstands cryogenic shocks and cycling
Outstanding mechanical strength properties
Excellent electrical insulation properties
Capable of passing NASA low outgassing
Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 - 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90°C for 3 - 5 hours.
KB 1039 CRLP-AO is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. Part A is black and Part B is off white in color. KB 1039 CRLP-AO is widely used in applications where thermal conductivity, low outgassing and cryogenic serviceability are key requirements.
TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation
Packing : Cans and Pails
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